PCB Manufacture Capacity

ItemSpecification
MaterialFR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,
     Aluminum  Base, Copper Base,Ceramic,    Crockery, etc.
RemarksHigh Tg CCL is    Available(Tg>=170℃)
Finish Board Thickness0.2 mm-6.00mm(8mil -126mil)
Surface    FinishGold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating    Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)
ShapeRouting、Punch、V-cut、Chamfer
Surface TreatmentSolder Mask(black, green, white,    red, blue, thickness>=12um, Block, BGA)
Silkscreen(black,    yellow, white)
Peel    able-mask(red, blue, thickness>=300um)
Minimum Core0.075mm(3mil)
Copper Thickness1/2 oz min; 12oz max
Min Trace Width & Line Spacing0.075mm /0.075mm (3mil/3mil)
Min Hole Diameter for CNC Drilling0.1mm(4mil)
Min Hole Diameter for Punching0.6mm(35mil)
Biggest panel size610mm * 508mm
Hole Position+/-0.075mm(3mil) CNC Drilling
Conductor Width(W)+/-0.05mm(2mil) or +/-20% of    original
Hole Diameter(H)PTHL:+/-0.075mm(3mil)
Non    PTHL:+/-0.05mm(2mil)
Outline Tolerance+/-0.1mm (4mil) CNC Routing  +/-0.1mm(5mil) CNC Routing
Warp & Twist0.70%
Insulation Resistance10Kohm -20Mohm
Conductivity<50ohm
Test Voltage10-300V
Panel Size110 x 100mm(min)
660    x 600mm(max)
Layer-layer misregistration4 layers:0.15mm(6mil)max
6    layers:0.25mm(10mil)max
Min    spacing between hole edge to circuitry
     pattern of an inner layer
0.25mm(10mil)
Min    spacing between board outline to circuitry
     pattern of an inner layer
0.25mm(10mil)


PCBA Capacity

SMT Capacity
SMT ItemCapacity
PCB Max. size510mm*460mm(SMT)
Chip component0805    0603  0402  0201 package
Min.pin space of IC0.1mm
Min. space of BGA0.1mm
Max.precision of IC assembly±0.03mm
Assembly capacity≥8    million piots/day
DIP capacity6 DIP    production lines
Assembly testingBridge    test, AOI test, X-Ray test, ICT(In Circuit Test), FCT(Functional Circuit    Test)

     FCT(Functional Circuit Test)
Current    test, voltage test, high temperature and low temperature test, Drop Impact    Test, aging test, water proof test, leakage-proof test and etc.                                   
     Different test can be done    according to your requirement.


Aluminium PCB Tech Specification

ItemCapabilities
Type of Alum boardsingle board, Insulation board,    double sided board
Finish Board Thickness0.4mm----- 3.0mm
Copper Thickness1 OZ--6 OZ
Min.Trace Width & Line Spacing0.15mm
Biggest size120cm*60cm
Type for surface treatmentOSP.HASL, Immersion Gold    ,Immersion Tin (lead free)
OSP0.20-0.40um
Thickness of Ni2.50-3.50um
Thickness of Au0.05-0.10um
Thickness of     tin5-20um
Thickness of immersion silver0.15-0.40um
Thermal conductivity1.0W -----3.0W
Dielectric Thickness50um-150um
Thermal resistance0.05℃/W -1.7℃/W
Minimum completed hole dimension±0.10mm
Tolerance for Hole Diameter±0.075mm
Minimum Drilling Hole Diameterφ0.8mm
Mask between pins0.15mm-0.35mm
Minimum spacing between Pad and Pad0.18mm-0.35mm
Outline tolerance±0.10mm
Minimum thickness for V-cut0.25mm
Outside copper thickness18-105um


FPC Tech Specification

ItemsCapabilities
LayersFPC:1 to 6 Layers,Rigid Flex:2 to 10 Layers
Regular Base MaterialsKapton,Polyimide(PI),Polyester(PET)
Base  Copper Thickness1/3 oz to 2oz
Regular Base Material Thickness12.5um    to 50um(FPC)
0.1mm to 3.2mm(Rigid)
Regular Coverlay Thickness27um to 50um
Regular Adhesive Thickness12um to 25um
Blind or Buried ViasYes
Impedance  ControlYes
Min.Line  Width/Spacing0.04mm/0.04mm
Surface  FinishingElectroplate Ni/Au(Flash gold/Soft gold/Hard gold),ENIG,Immersion
Tin; plated silver;immersion silver ; OSP ,HASL
Outline FabricationDie    cut,laser cut,CNC routing,V-scoring
Hole to edge(Hard tool/Die Cut)±0.1/±0.2mm
Edge to edge(Hard tool/Die Cut)±0.05/±0.2mm
Circuit to edge(Hard tool/Die Cut)±0.07/±0.2mm


Carbon PCB Capacity

Handle PCB( PS2,  XBOX,    etc)
Main    technical parameter: 
Rang of    total resistance:1 KΩ -1 MΩ
Resistance    tolerance:±20%
Resistance    to heat:260℃ ±5℃, 5sec. △TR≤±50%
Durability:1 Million cycles Min
Automobile component (Used for: windscreen wiper. Light and    air-condition)
Main    technical parameter:3 KΩ -1 MΩ
Resistance    taper:Linear
Resistance    tolerance:±20%
Linearity    tolerance:±1%
Durability:1 Million cycles Min
TCR:With ±1000    PPM (-30℃ — +70℃)
Electric drill component ( Used in speed    control, etc.)
Main    technical parameter:3 KΩ -3 MΩ
Resistance    tolerance:±20%
Linearity    tolerance:±1%
Durability:1 Million cycles Min


Ceramic Specification

ItemTest Conditionunitesenior
 materialAluminium nitride    Ceramic /Alumina 99.5%/Alumina 99%
Color    status   
average    crystal size  μm3月5日
volume    density g/cm³≧3.74
water    absorption  %0
Vickers hardness  Load 4.9Gpa≧15
flexural  Strength  Bending moment 80mmMpa≧324
Linear Coefficient of Thermal Expansion20-500℃1×10-605-7.5
20-800℃˚mm/℃6.5-8.0
thermal conductivity20℃W(m-k)≧170
Dielectric intensity Kv/mm≧12
Volume Resistance20℃Ω-cm≧1014
300℃≧1011
500℃≧109
Dielectric Constant1MHz 9.3-10.6
dielectric loss1MHz 3×10-4
Thermal - shock  850℃times≧7
roughness    of the surface Ra(λ2)μm0.20-0.75