2-Layers Board HDI Printed Circuit Made in China
Application: Consumer Electronics
Processing Technology: Electrolytic Foil
Base Material: Fr4
Surface Finishing: HASL
Board Thickness: 1.6mm
Min. Line Wigth: 0.075mm
Certificate: RoHS, UL, SGS, Ect
Structure: Multilayer Rigid PCB
Material: Polyester Glass Fiber Mat Laminate
Flame Retardant Properties: V0
Production Process: Subtractive Process
Insulation Materials: Organic Resin
Copper Thickness: 1oz
Min. Hole Size: 0.1mm
Min. Line Spacing: 0.075mm
HS Code: 85340090
WELCOME TO XD---------------
Shenzhen Xingda Electronic Technology Co., Ltd is a professional pcb manufacturer has over 10 years experience. We are able to offer 1 to 24 Layer PCB, ranging from pcb produce, components purchase, pcb assembly, pcb copy service.Our products are widely used in communication apparatus, automobile electronics, auto parts, medical devices, light systems, outdoor systems, network devices and consumer electronics class fields.
Place of Origin:
Guangdong China (Mainland)
Number of Layers:
Min. Hole Size:
Min. Line Width:
Min. Line Spacing:
Solder mask color:
* Low water absorption rate
* Hard to be deformed
* High mechanical strength
* Good electric performance wether under the moist or dry environment, Flame retardant grade could reach 94-V0
* High temperature resistant,high dielectric performance and mechanical processing performance.
PCB manufacture and PCB assembly
* PCB board file with parts list provided by customer
* PCB board made, circuit board parts purchased by us
* PCB board with parts assembled
* Electronic testing circuit board or PCB
* Fast delivery, anti-static package
* RoHS Directive-compliant, lead-free
* Visual Inspection
* Flying probe
* Impedance control
* Solder-ability detection
* Digital metallograghic microscope
*AOI (Automated Optical Inspection)
|Single/Double-sided Board/Multilayer Board/FPC(1-24Layer)|
|Base Materials||FR-4(High TG 150°-170°),FR1,Aluminum,CEM-3,BT,94vo|
|Finish copper thickness||Outer 6 OZ,Inner 4 OZ|
|Surface finish||ENIG, ImAg, ImSn, OSP, HASL,Plating gold|
|Finished Board Size||Max Double-sided Board||640mm χ 1100mm|
|Max Multilayer Board||640mm χ 1100mm|
|Finished Board Hole Size (PTH Hole)||Min Finished Board Hole Size||0.15mm|
|Conductor Width and Spacing||Min Conductor Width||0.01mm|
|Min Conductor Spacing||0.01mm|
|Thickness of Plating and Coating Layer||PTH Wall Copper Thickness||>0.02mm|
|Tin Solder Thickness ( Hot Air Leveling )||>0.02mm|
|Nickl/Gold Thickness||For customer special need|
|Nickl Plating Layer||>2um|
|Gold Plating Layer||>0.3um|
|Bare Board Test||Single Side Test||Max Test Point||20480|
|Max Board Test Size||400mm χ 300mm|
|Double Side Test||Max Test Point||40960(General Use)|
|Max Board Test Size||406mm χ 325mm|
|320mm χ 400mm|
|Min Test pitch of SMT||0.5mm|
|Mechanical Process||Chamfer||20°, 30°, 45°, 60°|
|Angle Tolerance||± 5°|
|Deepness Tolerance||± 0.20mm|
|V-Cut Angle||20°, 30°, 45°|
|Residues Thickness||± 0.025mm|
|Cell Paraposition Precision||± 0.025mm|
|Tolerance of Out-shape Process||± 0.1mm|
|Board Warp||Max Value||0.7%|
|Optical Plotting||Max Plotting Area||66mm χ 558.8mm|
|Repetitive Precision||± 0.005mm|
Detailed Terms for PCB Manufacturing
---Technical requirement for PCB assembly:
* Professional Surface-mounting and Through-hole soldering Technology
* Various sizes like 1206, 0805, 0603 components SMT technology
* ICT(In Circuit Test), FCT(Functional Circuit Test) technology.
* PCB Assembly With UL, CE, FCC, RoHS Approval
* Nitrogen gas reflow soldering technology for SMT.
* High Standard SMT&Solder Assembly Line
* High density interconnected board placement technology capacity.
Delivery Time for FPC board
1) FPC production time: Sample: 2-3 days / mass production: Within 7 days
2) Components purchase: 2 days if all components is available in our domestic market.
3) FPC Assembly: Samples: Whthin 2 days / mass production: Within 5 days
Following specifications are needed for quotation:
A) Base material:
B) Board thickness:
C) Copper thickness
D) Surface treatment:
E) color of solder mask and silkscreen:
Shipping Method and Payment terms:
1. By DHL, UPS, FedEx, TNT using clients account.
2. We suggest you using our DHL, UPS, FedEx, TNT forwarder.
3. By EMS (Usually for Russia Clients), price is high.
4. By sea for mass quantity according to customer's requirement.
5. By customer's Forwarder
6. By Paypal, T/T, West Union, etc.
FPC Process Capability
· processing layers:1-6 layers
· Finished thickness (thinnest): 3mil (0.08mm)
· Minimum aperture: 4mil (0.10mm)
· Minimum line width / spacing: 2 mil (0.05mm)
· Maximum board size: 10 "x 45" (250x 1200mm)
· Surface Treatment: OSP, HASL, Electric Nickel / Gold,Chemical nickel / gold, lead-free HASL, Immersion Gold
· Insulation resistance: ± 1011Ω
· Thermal shock resistance: 260 °C 10 sec.
· Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4
Double sided flexible circuit (FPC)
Consists of double-sided copper clad material with top and bottom cover films (PI or Green/Yellow Oil, Carbon Ink, etc).
Two conductive layers with an insulating layer between, plus conver layers on outer layer. The cover
films are pre-routed to access copper from both sides using plated thru holes(PTH).
A) We have many special material as rogers, teflon, taconic, Fr-4 high tg, Ceramic in stock. Welcome to send us your inquiry.
B) We also provide sourcing components, PCB design, PCB copy, PCB drawing, PCB assembly and so on.so provide sourcing components, PCB design, PCB copy, PCB drawing, PCB assembly and so on.
Welcome to contact me for more details about PCB!