99AI2O3 Aluminum Pastes Ships Equipment Ceramic Printed Circuit Board Assembly
Alumina Oxide (Al2O3) 96% or Alumina 96% is the most used ceramic material for ceramic printed circuit boards and packages. Thanks to its good thermal properties, low expansion and hermeticity in combination with a relatively low cost and a more easy handling. Applications include cooling and heating applications, LED boards, medical circuits, sensor modules and high-frequency devices.
Alumina 96% advantages over other printed circuit boards:
Higher operating temperature up to 350ºC
Lower expansion coefficient (6-8 ppm/ºC)
Good thermal properties (22-24 W/mK)
Superior high-frequency performance
Smaller package size due to integration and multi-layer possibilities
Cost effective for dense package due to parallel processing of layers
Hermetic packages possible, 0% water absorption
Good light reflection due to white color.
Limited to no outgassing
Strong rigid material
Circuits can either be printed using Copper (Cu) or Silver (Ag) depending on the application and the request. Copper is offered in DPC and silver using a thick film process. We advise copper in 1-2 layer applications from low to high volume applications. Silver is advised when going to multi-layer and only in medium to high volume due to the higher tooling costs.
Solder resist and surface finishes can be applied similarly to regular PCB when copper metallization is used. However, for silver thick film designs, we offer only a glass solder mask which is recommended for high-temperature designs. For high sulfur environments where silver corrosion can be an issue, we offer Gold plating as a solution to protect the exposed pads.
Comparison between ceramic and other material: