AI2O3 Silver Thread Military Radar Antenna Ceramic PCB Board Assembly

AI2O3 Silver Thread Military Radar Antenna Ceramic PCB Board Assembly
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Product Details

About XinDa

XD specializes in Alumina Oxide (Al2O3) and Aluminium Nitride boards (AlN) using thick film as well as direct bonded copper (DBC) and direct plated copper Technologies (DPC) to print the circuits.


Detail 

DBC heat-sinking substrate for solar battery is fabricated

by using bonding technology under high temperature.

The conjunction between copper foils and ceramic is molecular

bond and any adhesion agent is not being used.

 

Due to the fine adhesion between copper foils and ceramic plate.

it can suffer from strict thermal cycling test. under the normal

temperature environment,the isolation performance and material

strength can hold several hundred thousand hours stability.

Other materials can not compare to this on.

 

Because the ceramic material has fine thermal conductive property

the compound material has low resistance.

In the succeeding processes,by the photoresist and

Chemical etching methods and fine laser cutting process.

DBC heat-sinking substrate for solar battery possesses various accurate

and complex patterns and outlines.

 

Advantage: 

1. High thermal conductivity property and low thermal resistance,

Could increase the efficiency and operation lifetime of semi-conductor chips

 

2. Excellent thermal cycling performance and fine mechanic strength.

 

3.High isolating strength

 

4.The thermal expansion coefficient is close to that of the silicon chip.

 

5.Strong current conductive ability

 

6.Fine environment compatibility,no environment contaminative elements,

such as PB,Hg and Cr,etc.

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Comparion Between Ceramic and other material:


Ceramic PCB
FR4/CEM3
Metal Core PCB
PCB Thermal conductivity performance
High to excellent
Very low to medium(multilayer with filled vias)
Medium(dielectric layer reducing TC)
Coefficient of Thermal expansion
Good CTE matching with Microelectronic components and LED chips
Good CTE matching with Microelectronic components and LED chips
Moderate to bad CTE matching with Microelectronic components and LED chips
Thermal resistance
Suitable for high denisity applications with minimal spacing
Suitable for low density applications with large spacing
Suitable for medium density applications with moderate spacing
Max operating temperature
High
Low
High
High frequency performance
High
Low to moderate
Low
Mechanicall assembly and handling(stress)
Precation needed
Easy
Easy
Supplier availability
Low
High
High
Offered by Elite Advanced Technologies
Yes
Yes
Yes
Cost
Medium to High(multilayer with filled vias)
Low to medium(multilayer with filled vias)
Medium(AI) to High (Cu)

Our Service:

 

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Contact below:
Tel:+86-0755-23050569-824
mobile phone:+86-15919935669
Skype: xingdapcbsales10
Email: sales10@xdpcba.com
Website:  www.xdpcba.com

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