AI2O3 Silver Thread Military Radar Antenna Ceramic PCB Board Assembly
About XinDa
XD specializes in Alumina Oxide (Al2O3) and Aluminium Nitride boards (AlN) using thick film as well as direct bonded copper (DBC) and direct plated copper Technologies (DPC) to print the circuits.
Detail
DBC heat-sinking substrate for solar battery is fabricated
by using bonding technology under high temperature.
The conjunction between copper foils and ceramic is molecular
bond and any adhesion agent is not being used.
Due to the fine adhesion between copper foils and ceramic plate.
it can suffer from strict thermal cycling test. under the normal
temperature environment,the isolation performance and material
strength can hold several hundred thousand hours stability.
Other materials can not compare to this on.
Because the ceramic material has fine thermal conductive property
the compound material has low resistance.
In the succeeding processes,by the photoresist and
Chemical etching methods and fine laser cutting process.
DBC heat-sinking substrate for solar battery possesses various accurate
and complex patterns and outlines.
Advantage:
1. High thermal conductivity property and low thermal resistance,
Could increase the efficiency and operation lifetime of semi-conductor chips
2. Excellent thermal cycling performance and fine mechanic strength.
3.High isolating strength
4.The thermal expansion coefficient is close to that of the silicon chip.
5.Strong current conductive ability
6.Fine environment compatibility,no environment contaminative elements,
such as PB,Hg and Cr,etc.
Comparion Between Ceramic and other material:
|
|
Ceramic PCB |
FR4/CEM3 |
Metal Core PCB |
|
PCB Thermal conductivity performance |
High to excellent |
Very low to medium(multilayer with filled vias) |
Medium(dielectric layer reducing TC) |
|
Coefficient of Thermal expansion |
Good CTE matching with Microelectronic components and LED chips |
Good CTE matching with Microelectronic components and LED chips |
Moderate to bad CTE matching with Microelectronic components and LED chips |
|
Thermal resistance |
Suitable for high denisity applications with minimal spacing |
Suitable for low density applications with large spacing |
Suitable for medium density applications with moderate spacing |
|
Max operating temperature |
High |
Low |
High |
|
High frequency performance |
High |
Low to moderate |
Low |
|
Mechanicall assembly and handling(stress) |
Precation needed |
Easy |
Easy |
|
Supplier availability |
Low |
High |
High |
|
Offered by Elite Advanced Technologies |
Yes |
Yes |
Yes |
|
Cost |
Medium to High(multilayer with filled vias) |
Low to medium(multilayer with filled vias) |
Medium(AI) to High (Cu) |
Our Service:
Contact below:
Tel:+86-0755-23050569-824
mobile phone:+86-15919935669
Skype: xingdapcbsales10
Email: sales10@xdpcba.com
Website: www.xdpcba.com