High-Density Multilayer PCBs

High-Density Multilayer PCBs
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Product Details
DA Electric, one of the best manufacturers and suppliers in China, now brings you high-tech high-density multilayer pcbs at competitive price from its professional factory. With the most advanced technology and high-end equipment introduced from America and Japan, as well as qualified staff, we can assure you the high quality, high precision and long lifespan of our products.

Basic Info

  • Structure: Double-Sided Rigid PCB

  • Layer Count: 1-30 Layers

  • Copper Thickness: 0.5-6 Oz

  • Surface Treatment: HASL

  • Silk Screen: White, Black

  • Specification: CE, ISO, UL

  • Kind: Rigid PCB

  • Board Thickness: 0.2-5.0mm

  • Board Material: Fr4

  • Solder Mask: Green, Bule, Red, Black, Yellow, White

  • Origin: China(Mainland)

Product Description

Shenzhen Xingda Electronic Tech Co., Ltd. Is focus on manufacturing Printed Circuit Boards(PCB) and PCB Assembly(PCBA). OEM PCB, SMT, DIP and PCBA Assembly are our strengths.

Our aim: High quality, low cost & fast delivery for PCB and PCBA.
Service: One-stop-service for PCB and PCBA.
Verification: UL, ISO9001: 2000, RoHS

Product Description:
1. Single-sided PCB, double side & multi-layer PCB with competitive price, good quality and excellent service.
2. CEM-1, CEM-3 FR-4, FR-4 High TG, Aluminum base material.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
5. Quantities range from prototype to medium batch production.
6.100% E-Test.

PCB Base Material: Rogers
PCB Copper Thickness: 1/1
PCB Board Thickness: 0.3-5.0mm
PCB Min. Hole Size: 0.2mm
PCB Min. Line Width: 0.1mm
PCB Min. Line Spacing: 0.1mm
PCB Surface Finishing: HASL, HASL pb free, immersion gold, immersion silver, immersion tin, O. S. P (Entek), S/G plating, ENEPIG, G/F plating, carbon

NO ITEM Techinical capabilities
1 Materials CEM-1,CEM-3,FR-4, FR4 High TG, Teflon, Rogers,aluminium,ceramic, etc.
2 layers 1-22 layers
Min.core material
5mil(excluding copper)
4 Prepreg type 7628/2116/1080/3313
5 Max.board size 520*720mm
6 Copper thickness min.base copper 1/3 OZ
max.finished copper6OZ
7 Min.board thickness 2 layer 10mil/0.25mm
4 layer 16mil /0.4mm
6 layer 24mil/0.6mm
8 layer 32mil/0.8mm
10 layer 40mil/1.0mm
8 Max.board thickness 236mil/6mm (finished board thickness)
9 Min.line width/space 3mil/3mil HOZ copper base(inner layer)
10 Min.hole size 8mil
11 PTH wall thickness ≥1mil
12 Hole dia.tolerance(PTH) ±3mil
13 Hole dia.tolerance(NPTH) ±2mil
14 Countersink hole Min.depth(D)6mil;The Depth of tolerance± 6mil
  Drill bit grinding angles C≥90°~180°
Hole Dia.B tolerance ±4mil
Drill bit A ≥Φ40mil
15 Drilling hole positional deviation(outer layer) 1st-drill ±3mil(Normal) ±2mil(min.)           
2nd-drill ±4mil
16 Min.solder mask bridge 3.2mil(HOZ base copper, green)
17 Outline tolerance ±4mil
18 Twist & Bow ≤0.75%
19 Peelable mask thickness ≥8mil 1 printing
20 Insulation Resistance >10MΩ Normal
21 Through hole
≤100Ω Normal
22 Current breakdown 10A
23 Peel strength 1.4N/mm
24 S/M abrasion >6H
25 Thermal stress 288°C* 20Sec*3 times
26 Test Voltage 20-300V
27 Min.blind/burried via 8mil
29 Impedance control Single ended impedance 50Ω/70Ω±10% Normal
Differential impedance 90Ω/100Ω±10% Normal
30 Max.aspect ratio 12:1
Beveling of gold fingers






Anglesθ 20° 25° 30° 35° 60°
Bevel size H:Min.12mil, Max.71mil
the tolerance of bevel height: ±4mil
Board thickness T:Min32mil,Max.79mil