Low volume PCB board with carbon ink

Product Details

Using carbon ink in place of Hard gold is an option that offers lower costs and high robustness. Using carbon ink reduces material costs by replacing gold with carbon, and reduces process costs by “replacing the electrolytic bath with a simple screen-printing process.” And regarding Robustness, tests have shown that a typical carbon ink is hard enough to withstand >1 million pushbutton operations (keypad) or 100 insertion operations ... (edge connector) without showing wear or increased resistance.” However, it has been noted that “carbon inks must have good viscosity stability for warmer climates and require good printing properties to give even coverage over the copper pads.” Another disadvantage is that the cured carbon ink must be able to withstand process steps including “solvent cleaning and soldering without loss of adhesion and conductivity.”

Product Details

Key Specifications/Special Features:

Layers	2-64 layers
Board materials	CEM-1, FR4, aluminium base, high TG, Halogen-free
Board size	Maximum 510*1100mm
Board thickness	0.4-3.2mm
Copper foil thickness	(0.5 1 2 3 4) oz
Minimum line width	3 mil
Minimum line space	4 mil
Solder mask colors	Green, white, yellow, blue, red, black
Silkscreen	White, black, yellow, red, blue, green
Surface finish	Immersion gold, HAL LF, OSP, gold finger, carbon print, Peelable mask, blue mask, plating gold