Low volume PCB board with carbon ink

Low volume PCB board with carbon ink
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Product Details

Using carbon ink in place of Hard gold is an option that offers lower costs and high robustness. Using carbon ink reduces material costs by replacing gold with carbon, and reduces process costs by “replacing the electrolytic bath with a simple screen-printing process.” And regarding Robustness, tests have shown that a typical carbon ink is hard enough to withstand >1 million pushbutton operations (keypad) or 100 insertion operations ... (edge connector) without showing wear or increased resistance.”  However, it has been noted that “carbon inks must have good viscosity stability for warmer climates and require good printing properties to give even coverage over the copper pads.” Another disadvantage is that the cured carbon ink must be able to withstand process steps including “solvent cleaning and soldering without loss of adhesion and conductivity.”

Product Details

 Key Specifications/Special Features:


Layers 2-64 layers
Board materials CEM-1, FR4, aluminium base, high TG, Halogen-free
Board size Maximum 510*1100mm
Board thickness  0.4-3.2mm
Copper foil thickness (0.5 1 2 3 4) oz 
Minimum line width 3 mil
Minimum line space 4 mil
Solder mask colors Green, white, yellow, blue, red, black
Silkscreen White, black, yellow, red, blue, green
Surface finish Immersion gold, HAL LF, OSP, gold finger, carbon print, Peelable mask, blue mask, plating gold

Primary Competitive Advantages:

  • International Approvals

  • Price

  • Product Features

  • Product Performance

  • Prompt Delivery

  • Quality Approvals

  • Small Orders Accepted

Main Export Markets:

  • Eastern Europe

  • North America

  • Western Europe

Delivery Details:

  • FOB Port:Shenzhen
  • FOB  Range:US$ 0.5 - US$ 23.5 per unit (Pieces)
  • HTS Code:8534.00.90 00

Contact:

Tel:+86-0755-29621535 Ext:817
mobile phone:+86-13420550989
Skype: live:sales5_2129
Email: sales5@xdpcba.com
Website:  www.xdxpcb.com 




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