Pottery Impedance PCB
Apart from MCPCB, if you want to use PCB in high pressure, high insulation, high frequency, high temperature, and high reliable and minor volume electronic products, then Ceramic PCB will be your best choice.
Why Ceramic PCB has such excellent performance? You can have a brief view on its basic structure and then you will understand.
- 96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)
- Conductors material: For thin, thick film technology, it'll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only
- Application temp: -55~850C
- Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO;
- Max compression strength: >7,000 N/cm2
- Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
- Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)
|A) Thick Film Ceramic Board|
Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate.
|B) Thin Film Ceramic Board|
Thin Film Technology Ceramic PCB: Because the thickness of electric resistance and conductor film less than 10 micron, and that film was spurting on ceramic substrate, so named thin film ceramic board.
|C) DCB Ceramic Board|
DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or AIN), on one or both sides, are directly bonded under appropriate high temperature and pressure.
|Application of Ceramic PCB|