Polyimide OSP Printer Single Sided FPCB
FPC Process Capability
· processing layers:1-6 layers
· Finished thickness (thinnest): 3mil (0.08mm)
· Minimum aperture: 4mil (0.10mm)
· Minimum line width / spacing: 2 mil (0.05mm)
· Maximum board size: 10 "x 45" (250x 1200mm)
· Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold
· Insulation resistance: ± 1011Ω (Normal Normal
· Thermal shock resistance: 260 °C 10 sec.
· Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4
Double sided flexible circuit (FPC)
Consists of double-sided copper clad material with top and bottom cover films (PI or Green/Yellow Oil, Carbon Ink, etc).
Two conductive layers with an insulating layer between, plus conver layers on outer layer. The cover
films are pre-routed to access copper from both sides using plated thru holes(PTH).
Delivery Time for FPC board
1) FPC production time: Sample: 2-3 days / mass production: Within 7 days
2) Components purchase: 2 days if all components is available in our domestic market.
3) FPC Assembly: Samples: Whthin 2 days / mass production: Within 5 days