Flex-PCB For Smart Card Professional Smart Card FPC Assembly

Flex-PCB For Smart Card Professional Smart Card FPC Assembly
Product Details


XINGDA Electric, one of the best manufacturers and suppliers in China, now brings you high-tech flex-pcb for smart card professional smart card fpc assembly at competitive price from its professional factory. With the most advanced technology and high-end equipment introduced from America and Japan, as well as qualified staff, we can assure you the high quality, high precision and long lifespan of our products.



Our strict quality control system for PCBA/FPCA:
1. E-test for FPC.
2. IQC for components.
3. AOI test
4. FPCA function test
5. FQC

We can provide FPCA for prototypes, small volume and mass production.

PCB Manufacture Capability

Item

Specification

Material

FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.

Remarks

High Tg CCL is Available(Tg>=170℃)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)

Shape

Routing、Punch、V-cut、Chamfer

Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Minimum Core

0.075mm(3mil)

Copper Thickness

1/2 oz min; 12oz max

Min Trace Width & Line Spacing

0.075mm/0.075mm(3mil/3mil)

Min Hole Diameter for CNC Drilling

0.1mm(4mil)

Min Hole Diameter for Punching

0.6mm(35mil)

Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Conductor Width(W)

+/-0.05mm(2mil) or +/-20% of original

Hole Diameter(H)

PTHL:+/-0.075mm(3mil)

Non PTHL:+/-0.05mm(2mil)

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Panel Size

110 x 100mm(min)

660 x 600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min spacing between hole edge to circuitry pattern of an inner layer

0.25mm(10mil)

Min spacing between board outline to circuitry pattern of an inner layer

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

 



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