2L Carbon PCB, OSP 1.6mm 35UM

Product Details


Key Specifications/Special Features:

Number of layer: double side PCB
Material: FR-4, CEM-3, High Tg, aluminum, halogen-free

PCB thickness:
Min thickness is 0.2mm (8mil)
Max thickness is 3.2mm (128mil)
Surface finished:
Gold plating, immersion gold (silver), HAL lead-free
Hot air solder leveling (HASL), Entek coating (OSP)
Soldermask: green, white, black, yellow, red, blue
Other printing: gold finger, carbon print, peelable mask, solder mask plugged hole
Copper thickness: 1/2oz (18μm) - 4oz (140μm)
Min finished hole size: 0.25mm (12mil)
Hole size tolerance (PTH): +/-0.076mm (3 mil)
Hole size tolerance (NPTH): +/-0.05mm (2 mil)
Min line width and spacing: 0.10mm (4 mil)
Min solder mask clearance : 0.076mm (3 mil)
Min annular ring: 0.1mm (4mil)
Profile and V-cut: CNC-routing, stamping and beveling, V-cut, CNC
Special process: micro-section, chamfer for gold finger

Primary Competitive Advantages:

  • Brand-name Parts

  • Country of Origin

  • Distributorships Offered

  • Electronic Link

  • Experienced Staff

  • Form A

  • Green Product

  • Guarantee/Warranty

  • International Approvals

  • Military Specifications

  • Packaging

  • Price

  • Product Features

  • Product Performance

  • Prompt Delivery

  • Quality Approvals

  • Reputation

  • Service

  • Small Orders Accepted

Main Export Markets:

  • Asia

  • Australasia

  • Central/South America

  • Eastern Europe

  • Mid East/Africa

  • North America

  • Western Europe

Payment Details:

  • Payment Method:Telegraphic Transfer in Advance (Advance TT, T/T)

  • Minimum Order:1        Pieces

Delivery Details:


  • FOB Port:Shanghai

  • FOB  Range: US$ 1 per unit (Pieces)

  • Lead Time: 3        -        7        days

Any third-party trademarks or images shown here are for reference purposes only. We are not authorized to sell any items bearing such trademarks.