A drawing about the production process of PCB

A drawing about the production process of PCB


Flow chart

the production process of PCB.jpg

Cut

Objective: according to the requirement of engineering data, the board is cut into small pieces on the large board which meets the requirements of customers.

Process: large board→Cutting board according to MI requirements→Curium board→Corner grinding→Exit board


Drill

Objective: according to the engineering data, the required aperture is drilled in the corresponding position on the board with the required size.

Process: laminated pin→Upper board→Borehole→Lower board→Check and repair


PTH

Objective: PTH is a thin layer of copper deposited on the insulating hole wall by chemical method.

Process: Rough grinding→Hanging board→Copper sinking automatic line→Lower plate→Dipping% dilute H _ 2SO _ 4→Thickened copper


Graphic transfer

Objective: graphic transfer is the production of film on the image transferred to the board.

Blue oil process: grinding board→First side of printing→Drying→Print second side→Drying →Exploding light→Shadow→Check (dry membrane process): hemp board→Pressure film→Statics→Pair position→Exposure→Statics→Shadow→Check


Graphic electroplating

Objective: graphic electroplating is a kind of copper layer with the required thickness and gold nickel or tin coating with the required thickness on the exposed copper sheet or hole wall of the line pattern.

Process: upper board→Deoiling→Wash twice→Micro erosion→Water washing→Pickling→Copper plating→Water washing→Pickling acid→Tin plating→Water washing→Lower board


Desensitized film

Objective: to remove the anti-plating coating with NaOH solution and expose the non-line copper layer.

Process: water film: insert frame→Soaking alkali→Washing→Scrub→Dry film: board placement→Passing machine


Etching

Objective: etching is the use of chemical reaction to remove copper layer off line.


Green oil

Objective: green oil is to transfer the pattern of green oil film to the board to protect the circuit and prevent the welding parts of the line of tin role.

Process: grinding board→Sensitive green oil→Curium board→Exposure→Grinding board→First side of printing→Baking board→Print second side→Baking board


Engend

Objective:characters are easily recognizable marks.

Process: green oil after curium. →Cooling statics. →Tuning network. →Printed character. →Posterior curium


Gold-plated finger

Objective: to coat the plug finger with a nickel-gold layer of required thickness to make it wear resistant to hardness.

Process: upper board→Deoiling→Wash twice→Micro erosion→Wash twice→Pickling→Copper plating→Water washing→Nickel plating→Water washing→Gold plating


Tinplate (a process of juxtaposition)

Objective: tin spray is to spray a layer of lead tin on the bare copper surface which is not covered with the resistance welding oil to protect the copper surface from corrosion and oxidation and to ensure good weldability.

Process: micro erosion→Air drying→Preheating→Rosin coating→Solder coating→Hot air leveling→Air cooling→Washing air drying


Shaping

Objective: to form the shapes needed by customers by stamping or CNC gongs. Organic gongs, beer boards, hand gongs, hand gongs are cut by hand.

Explanation: the accuracy of data gongs and beer boards is high, hand gongs, hand cut boards, the lowest can only do some simple shape.


Testing

Objective: to detect the functional defects such as open circuit and short circuit by electronic 00% test.

Flow process: upper mould, discharge board, test, qualified, FQC eye examination, unqualified, repair, return test, OK, REJ, scrap.


Final inspection

Objective: to detect the appearance defect of the board in 00% and repair the slight defect to avoid any problems and defects.

Specific workflow: incoming materials. →View data. →Eye inspection. →Qualified. →FQA spot check. →Qualified. →Packing. →Not qualified. →Processing. →Check OK.