BGA assembly is a type of surface mount technology, which is used for integrated circuits.
Our capabilities in BGA assembly are as follows:
We offer the entire gamut of Assembly services for BGAs, including:
We provide these with ultra-fine pitch quad flat packages (QFP), Quad Flat No Lead Package (QFN), and Chip Scale Packages (CSP). We analyze BGA data sheets, BGA size and ball material composition. We optimize the thermal profile of the BGAs to improve the quality of the assembly process.
We utilize the latest equipment in automated Surface Mount Technology (SMT) assembly to help us meet this goal:
Automated Placement Machines
Automatic Solder Dispensing Machine
X-ray and AOI Inspection Systems
Specialized Inspection Systems for solder ball height and coverage
An ESD and climate controlled environment is also utilized to ensure that the finished products meet all standards of efficiency, reliability, and quality.
Review and Rework Services
Apart from these, we can also provide rework and reballing services for BGAs that are already in use. Our rework and reballing capabilities include BGA removal and replacement, rework of ceramic and plastic BGAs and reballing of MBGAs. Our BGA rework process comprises:
Our rework processes are guaranteed to protect the circuit board from any future damage.
The ball grid assembly provides various advantages, and are becoming integral part of electronic circuits.
Improved Manufacturing: BGA assembly helps improve soldering, which further improves manufacturing yields. Ball grid arrays feature wide spacing between connections, which also improves the solderability.
No Pin Bridging: BGAs are used in miniature packages for ICs having hundreds of pins. As a BGA improves solderability, there are lesser or no chances of adjacent pins bridging together when the solder is applied.
Efficient Use of Space: BGAs allow efficient use of space on a printed circuit board. This helps add connections around the edges, as well as under the SMD package.
Low-inductance Leads: Ball grid arrays have very short space between the PCB and package. They have low inductances and so, have superior electrical performance to leaded devices.
Heat Conduction: Ball grid array packages with distinct leads have lesser resistance to heat between the PCB and the package. This lets the heat generated by an IC inside the package to flow more effortlessly to the PCB. This protects the chip from getting overheated.