Discussion on Solution of FPC Flexible Circuit Board Overflow Glue
Effluent is a common quality anomaly in the FPC flexible circuit board pressing process. Effluent refers to the temperature rise in the press-fit process, which causes the COVERLAY to flow in the gel system, resulting that the PAD position in the FPC flexible circuit board produces a glue problem that is similar to the EXPORY series.
There are many reasons for the overflow of FPC flexible circuit boards, so we should propose different solutions according to the specific situation.
1. The overflow glue is caused by the manufacturing process of COVERLAY.
Then, FPC flexible circuit board manufacturers should strictly check the material incoming materials. If the overflowing rubber exceeds the standard in the incoming sampling inspection, contact the supplier for return, otherwise it is difficult to control the overflow in the production process.
2. The overflow glue is caused by the storage environment.
FPC flexible circuit board manufacturers should set up a special freezer to store the protective film. If the CL glue is damp due to the failure of the storage conditions, the CL pre-bake can be used to improve the amount of CL overflow. In addition, the CL that has not been used that day needs to be put back into the freezer in time.
3. Local overflow caused by independent small PAD position.
This phenomenon is one of the most common quality anomalies encountered by most FPC flexible circuit board manufacturers in China. If the process parameters are changed simply to solve the overflow, it will bring new problems such as bubbles or insufficient peeling strength. It is reasonable to adjust the process parameters.
4. The overflow glue brought by the operation mode.
When the FPC flexible circuit board is super-synthesized, it is required to accurately align the personnel, correct the alignment fixture, and increase the inspection strength of the alignment to avoid overflow due to misalignment. At the same time, do a good job of “5S” when pressing the dummy joint. Before the alignment, check whether the protective film CL is contaminated and whether there is any burrs.
5. Overflow caused by FPC flexible circuit board factory process.
If the press is fast press, then prolonging the preload time, reducing the pressure, lowering the temperature, and reducing the press time are all beneficial to reduce the amount of glue overflow. If the pressure of the press is not uniform, you can use the induction paper to test whether the pressure of the press is uniform. You can contact the quick press supplier to debug the machine.