Five development trends of PCB technology

In the 21st century, mankind has entered a highly information-based society, and PCB is an indispensable and important pillar in the information industry.


      Electronic equipment requires high performance, high speed, thinness and shortness. As a multidisciplinary industry, PCB is the most critical technology for high-end electronic equipment. PCB products, regardless of rigid, flexible, rigid-flex combined multilayer boards, and module substrates for IC packaging substrates, have made great contributions to high-end electronic equipment. The PCB industry occupies an important position in electronic interconnection technology.


I. Development along the road of high-density interconnect technology (HDI)


As HDI embodies the most advanced technology of contemporary PCB, it brings fine wiring and micro-aperture to PCB. In the application of HDI multi-layer board terminal electronic products-mobile phones (mobile phones) are a model of HDI cutting-edge development technology. In mobile phones, the fine wires of the PCB motherboard (50μm ~ 75μm / 50μm ~ 75μm, wire width / pitch) have become the mainstream.In addition, the conductive layer and board thickness have been reduced; the conductive patterns have been miniaturized, which has led to higher density and higher performance of electronic equipment. .


HDI has promoted the development of mobile phones for more than two decades, driving the development of information processing and control of basic frequency functions of LSI and CSP chips (packages) and template substrates for packaging. It has also promoted the development of PCB, so it must continue to develop along the HDI road.


Second, the component embedding technology has strong vitality


Semiconductor components (called active components), electronic components (called passive components), or passive component functions are formed on the inner layer of the PCB. "Component embedded PCB" has begun mass production. Component embedded technology is based on PCB functional integrated circuits. Great changes, but the development must solve the analog design method, production technology and check the quality, reliability assurance is the top priority.


In order to maintain a strong vitality, we need to invest more in systems including design, equipment, testing, and simulation.


Third, the development of materials in PCB must go to the next level


Regardless of whether it is a rigid PCB or a flexible PCB material, with the global lead-free of electronic products, it is required to make these materials more heat resistant, so new high Tg, small thermal expansion coefficient, small dielectric constant, and excellent dielectric loss tangent materials keep appearing.


Fourth, the optoelectronic PCB has a bright future


It uses the optical path layer and the circuit layer to transmit signals. The key to this new technology is to manufacture the optical path layer (optical waveguide layer). It is an organic polymer formed by lithography, laser ablation, and reactive ion etching. At present, the technology has been industrialized in Japan and the United States.


Fifth, the manufacturing process must be updated, and advanced equipment must be introduced.


Manufacturing process


HDI manufacturing has matured and is becoming more and more perfect. With the development of PCB technology, although the subtractive manufacturing method commonly used in the past still dominates, low-cost processes such as additive and semi-additive methods have begun to rise.


A novel method for manufacturing a flexible board using nanotechnology to metalize holes while forming PCB conductive patterns.


High reliability, high quality printing method, inkjet PCB process.


2. Advanced equipment


Production of fine wires, new high-resolution photomasks and exposure devices, and direct laser exposure devices.


Uniform plating equipment.


Embedded component (passive active component) manufacturing and installation equipment and facilities.