FPC–the potential share which cannot be underestimated in PCB industry

FPCthe potential share which cannot be underestimated in PCB industry

 

In the past decade, China's electronic information industry has developed rapidly and the scale of its industries has continued to expand. China has become the world's largest consumer electronics product market, and the upstream and downstream industry chains are supporting the needs of the PCB industry. Smart mobile phones and other mobile electronic products continue to prosper, wearable smart devices, drones and other emerging consumer electronics products market is also rapidly rising, the trend of equipment miniaturization, becoming lighter and thinner is more obvious, traditional PCB can no longer meet the requirements of the product. For this reason, major manufacturers began to research new technologies to replace PCBs, and among these, FPC, as the most favored technology, is becoming the main connection component of electronic devices.

 

FPC is the fastest growing sub-sector in PCBs. FPC is a highly reliable and excellent flexible printed circuit board made of a flexible copper clad laminate. It is a substrate for connecting electronic components and a medium for signal transmission of electronic products.

 

As an important category of PCB, FPC has the exclusive advantages of high wiring density, light weight, thin thickness, foldability, bending resistance, high temperature resistance, three-dimensional wiring, etc and is more in line with the intelligentialize and portability of electronic products in downstream industries. Therefore, FPC is bound to be widely used.

 

Combined with Prismark's forecast, it is expected that by 2017 global FPC output value is expected to be close to US$15.7 billion, accounting for 23.9% of the total PCB industry. Based on FPC's compliance with the future trend of upgrading the PCB industry, we expect the FPC industry to maintain a compound growth rate of 5-10% in the next five years and continue to lead the PCB industry. The FPC market size should not be underestimated.

 

FPC has obvious advantages in the display module, the touch module, the fingerprint identification module, the side keys, and the power button of the smart phone. About 14-16 FPCs are used in the new iPhone, which together with other PCB materials account for $15 of the cost. Huawei, OPPO, vivo and other domestic mobile phone manufacturers have also increased the use of FPC in high-end flagship machines. The usage is currently about 10-12 blocks, and future usage is expected to continue to increase under the trend of high-end.

 

With the rise of the global wearable market, Google, Microsoft, Apple, Samsung, Sony and other international large-scale electronic equipment manufacturers have increased investment in wearable devices and R & D, domestic companies like Baidu, Tencent, Qihoo 360, Mi and other industries giants have also laid out the field of wearable devices. FPC performance characteristics are in line with wearable device requirements and become the first choice for wearable devices. Therefore, the rapid development of emerging terminal products such as wearable devices will also make FPC application fields continue to expand.

 

FPC's unique features can meet multiple R&D requirements, which will determine the huge future potential of the FPC market.

 

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