Global HDI Development
In 2025, the global HDI printed circuit board market is expected to reach $24.63 billion, with a compound annual growth rate of 12.8%. The increasing miniaturization of electronic devices, the rapid tendency of consumers to smart devices, the significant growth of consumer electronics and the increasing adoption of car safety measures are driving the market's gradual growth.
In addition, the increasing popularity of smart wearable devices may also drive demand for high-density interconnect PCB during the forecast period. However, the high cost coupled with the lack of expertise in manufacturing HDI printed circuit boards is expected to hinder market growth during the 2019-2025 period.
It is estimated that the compound annual growth rate of the 12-layer and above layers is the highest during the forecast period. Segment growth is attributed to the increasing deployment of HDI printed circuit boards in many applications, such as mobile devices, automotive products, and more.