Gold Finger PCB

Product Detail

Basic Info
  • Model NO.:gold-001

  • Structure:Multilayer Rigid PCB

  • Dielectric:FR-4

  • Material:Epoxide Woven Glass Fabric Laminate

  • Application:Computer

  • Flame Retardant Properties:V2

  • Processing Technology:Delay Pressure Foil

  • Production Process:Subtractive Process

  • Base Material:Copper

  • Insulation Materials:Epoxy Resin

  • Brand:Quick

  • Type:Positive PCB

  • Color:Green

  • Layer:10

  • Technology:Carbon, Enig, HASL Lf

Product Description

Name: Gold finger PCB
Multilayer PCB; ten layers; FR4 base material; Immersion gold surface finish; green solder mask; 0.1/0.1mm line width/spacing; 0.25mm Min hole diameter; 92*210mm board size; 1.6mm board thickness; 230 to 260ºC soldering temperature;Impedance control; UL,RoHS;
type of products: Multilayer PCBs
Number of layers: 10 layers
Base material: FR4
Board thickness: 1.6mm
Surface finish: Immersion gold
Solder mask: Green
Line width: 0.1 mm
Line spacing: 0.1 mm
Hole diameter: 0.25 mm
Board dimension: 92*210mm
Others: Impedance control
Standard:UL,RoHS;IPC6012 ClassII