Manufacturing process of FPC Circuit Board

                                                                    Manufacturing process of FPC Circuit Board


    The production process of flexible printed circuit boards is basically similar to that of rigid boards. For certain operations. The flexibility of laminates requires different devices and completely different processing methods. Most flexible printed circuit boards use negative methods. However. There are some difficulties in machining and coaxial processing of flexible laminates. One of the main problems is the treatment of substrates. Flexible materials are coiled with different widths, so during etching. A rigid bracket is required for the transfer of flexible laminates.


     Usually, due to the limited heat resistance of substrate, the welding in flexible printed circuit is more important. Manual welding requires enough experience, so if possible, wave soldering should be used. When welding flexible printed circuit, we should pay attention to the following matters.
1) because polyimide is hygroscopic, the circuit must be baked before welding (continuous 1h in 250 F).
2) pad is placed in a large conductor area, such as ground connection, power supply or radiator, should reduce the heat dissipation area, as shown in Figure 12-16, which limits heat emission and makes welding easier.
3) when a hand welding pin is carried out in a dense area, it is necessary to avoid continuous welding of the adjacent pins and move the welding back and forth in order to avoid local overheating.
A page can be obtained from several sources in the flexible printed circuit design and processing of information, but the best source of information is processing materials and chemicals producer / supplier. The supplier to provide information and processing expert scientific experience, can produce high quality flexible printed circuit board.