Manufacture Capabilities

Lead Free process

Double-side SMT + Thru-hole

High-speed Pick & Place + Wavesolder

Quick turn & Prototyping our specialty

Design Review for Manufacturability

Flex Circuit Assembly

μBGA, CSP, BGA attach to 45 mm max size

Fine-pitch SMT, QFP down to 16 mil 


Pick & Place 0201 components

Small Parts Assembly and Soldering

Rework, Parts Recovery, Rebuild

Connector and terminal press-fit capability

Water Soluble processes + Aqueous Cleaning

Consignment 、 Turnkey Service


Quality Certification

Certified ISO 9002

Quality Management Process

Quality Assurance Standard

Quality Assurance System

Quality Assurance Practice

Critical Quality Test

3D Test Equipment

X-RAY Test 


Environment Test Equipment 

( Including High Temperature & Humidity 、 Low Temperature & Humidity 、 Temperature & Humidity Cycle Test)