Six automated placement systems available with Vision Systems capable of inspecting solder ball coverage. Two automated systems available with 3-D laser capable of inspecting solder ball height Automatic placement of CBGA, PBGA and MBGA Verification of BGA’s using Phoenix real-time x-ray system 

Ball Grid Array (BGA) style circuit boards, which used small circular balls of solder to allow the flow of electricity between parts of the circuit. This brought with it a number of advantages to PCB assembly: 

Higher-density circuits: As through-hole circuits were more densely-populated, soldering them accurately without crossover or short-circuits became nearly impossible. Heat conduction: BGA circuits allow heat to pass much more easily from the integrated circuit outwards, reducing overheating problems. Lower inductance: Because each solder ball in an BGA circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly minimized.


1. Ball Grid Array (BGA)

2. Ultra-Fine Ball Grid Array (uBGA)

3. Quad Flat Pack No-Lead (QFN)

4. Quad Flat Package (QFP)

5. Plastic Leaded Chip Carrier (PLCC) 6. SOIC, Package-On-Package (PoP)

7. Small Chip Packages (Pitch of 0.2 mm)

Through-Hole Assembly

Automated Through-Hole Assembly

Manual Through-Hole Assembly

Through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or electromechanical relays that require great strength in support


Mixed Assembly - Through-Hole, SMT and BGA components are housed on the PCB. Single- or double-sided mixed technology or SMT (Surface Mount) for PCB assembly. Single- or double-sided BGA and micro-BGA installation and rework with 100% X-ray inspection