PCB board cooling tips
The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat does not dissipate in time, the device will continue to heat up and the device will fail due to overheating and the reliability of the electronic device will decrease. Therefore, dissipating the board is very important.
Plate cooling method：
1, high heat device plus heat sink, heat conducting plate
When there is a small amount of device in the PCB that generates a large amount of heat (less than 3), a heat sink or heat pipe may be added to the heat generating device. When the temperature cannot be lowered, a fan-mounted heat sink can be used to enhance heat dissipation. influences. When the number of heat generating devices is large (greater than 3), a large heat dissipating cover (plate) can be used, which is a dedicated heat sink customized according to the position and height of the heat generating device. PCB or large flat heatsink. Place the upper and lower parts of the different components. The heat shield is integrally fixed to the surface of the component and is in contact with each component to dissipate heat. However, due to the poor consistency of the components during the soldering process, the heat dissipation effect is not good. A soft thermal phase change thermal pad is usually added to the surface of the component to improve heat dissipation.
2. For devices that use free convection air cooling, it is preferable to arrange the integrated circuit (or other device) in a vertically long or horizontally long manner.
3. Equipment on the same printed board should be arranged as much as possible according to the heat and heat generated by it. Devices with low heat generation or poor heat resistance (such as small signal transistors, small integrated circuits, electrolytic capacitors, etc.) should be placed. The uppermost stream of cooling gas (at the inlet), a device that generates a large amount of heat or heat (EG, power transistors, large scale integrated circuits, etc.) is placed at the most downstream of the cooling. air flow.
4. In the horizontal direction, the high power device is placed as close as possible to the edge of the printed circuit board to shorten the heat transfer path; in the vertical direction, the high power device is placed as close as possible to the top of the printed circuit board so that when these devices are in operation Reduce the temperature of other devices. influences.
5. Temperature sensitive equipment should be placed in the lowest temperature zone (EG bottom of the equipment). Do not place it directly above the heating device. The plurality of devices are preferably staggered in a horizontal plane.