PCB board material and parameter introduction

PCB circuit board material introduction: According to the brand quality level from bottom to top divided as follows: 94HB-94VO 22F-CEM-1-CEM-3-FR-4

Detailed parameters and uses are as follows:

94HB: Ordinary cardboard, not fireproof (lowest material, die punching, cannot be used as a power panel)

94V0: Flame-retardant cardboard (die punching)

22F: Single Half Fiberglass board (Die Punching)

CEM-1: single-sided fiberglass fiber board (must be drilled by computer, can not be punched)

CEM-3: double-sided half glass fiber board (in addition to double-sided cardboard is the lowest end of the double-sided material, a simple double-sided board can use this material, will be cheaper than the FR-4 5 ~ 10 yuan / square meter)

FR-4: Double-sided Fiberglass Board

 

Classification of flame retardant characteristics can be divided into 94VO-V-1 -V-2 -94HB four kinds

Prepreg: 1080 = 0.0712mm, 2116 = 0.1143mm, 7628 = 0.1778mm

FR4 CEM-3 are for sheet metal, fr4 is fiberglass board, cem3 is composite substrate board

Halogen-free refers to a substrate that does not contain halogens (such as Fluorine, bromine, iodine and so on), because bromine generates toxic gases when burned, and environmental protection is required.

Tg is the glass transition temperature, that's the melting point.

The circuit board must be flammable, cannot burn at a certain temperature, and can only be softened. The temperature point at this time is called the glass transition temperature (Tg point), and this value is related to the dimensional durability of the PCB board.

What are the advantages of high Tg PCB boards and the use of high Tg PCBs?


When the temperature rises to a certain threshold, the substrate of High Tg Printed Circuit Boards changes from a "glassy state" to a "rubbery state," and the temperature at that time is called the glass transition temperature (Tg) of the board. That is, Tg is the maximum temperature (° C.) at which the substrate maintains rigidity. That is to say, ordinary PCB substrate materials continue to produce softening, deformation, melting, etc. at high temperatures, and also show a sharp decline in mechanical and electrical properties. This affects the service life of the products. Generally, the Tg plate is 130. Above °C, high Tg is generally greater than 170 °C, medium Tg is greater than 150 °C; PCBs with Tg ≥ 170 °C are commonly referred to as high Tg printed boards; the Tg of the substrate is increased, and the heat resistance of the printed board is increased. Moisture resistance, chemical resistance, stability and other characteristics will be improved and improved. The higher the TG value, the better the temperature resistance of the sheet, especially in the lead-free process, high Tg applications are more; high Tg refers to high heat resistance. With the rapid development of the electronics industry, electronic products represented by computers, in particular, are moving towards higher functionality and higher levels of multi-layered development, and the higher heat resistance of PCB substrates is a prerequisite. The emergence and development of high-density mounting technologies represented by SMT and CMT have made PCBs increasingly inseparable from the substrate's high heat resistance in terms of small apertures, fine lines, and thinness.


Therefore, the difference between the general FR-4 and high Tg: At the same time under high temperature, especially after heat absorption, the mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion, etc. There are differences in the situation, high Tg products are obviously better than ordinary PCB substrate materials.

PCB board knowledge and standards At present, China's extensive use of copper-clad board has the following types, its characteristics are as follows: type of copper-clad board, copper-clad board knowledge, copper-clad board classification methods are many. According to the different reinforcing materials of the board, it can be divided into five categories: paper base, glass fiber cloth base, composite base (CEM series), multi-layer base board and special material base (ceramic, metal core base, etc.). If the classification is based on different resin adhesives used on the board, common paper-based CCI. There are various types of phenolic resins (XPc, XxxPC, FR-1, FR-2, etc.), epoxy resins (FE-3), and polyester resins. The common glass fiber cloth-based CCL has epoxy resin (FR-4, FR-5), which is currently the most widely used type of glass fiber cloth base. In addition, there are other special resins (glass fiber cloth, polyamide fibers, non-woven fabrics, etc. as additional materials): Bismaleimide modified triazine resin (BT), polyimide resin (PI) Diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, etc. According to the classification of the flame retardancy of CCL, it can be divided into two types of flame-retardant (UL94-VO, UL94-V1) and non-flame-retardant (UL94-HB) board. In the past year or two, as more attention was paid to environmental protection issues, a new type of CCL that does not contain bromine in the flame-retardant CCL has been classified as a “green type flame retardant CCL”. With the rapid development of electronic product technology, there are higher performance requirements for CCL. Therefore, from the performance classification of CCL, it is divided into general performance CCL, low dielectric constant CCL, high heat resistance CCL (L of general board is above 150° C.), low thermal expansion coefficient CCL (usually used on package substrates ) And other types. With the development and continuous advancement of electronic technology, new requirements have been continuously put forward for printed circuit board substrate materials, thereby promoting the continuous development of the copper clad board standard. At present, the main criteria for substrate materials are as follows.

 

1 National Standards: China's national standards for substrate materials are GB/T 4721-47221992 and GB 4723-4725-1992. The copper-clad plate standard in China's Taiwan region is the CNS standard, which is based on the Japanese JIs standard. It was established in 1983.


2 International Standards: Japanese JIS Standards, American ASTM, NEMA, MIL, IPc, ANSI, UL Standards, British Bs Standards, German DIN, VDE Standards, French NFC, UTE Standards, Canadian CSA Standards, Australian AS Standards, FOCT Standards of the Former Soviet Union, International IEC Standards, etc.; Suppliers of PCB design materials are commonly used and commonly used: Shengyi, Jiantao, International, etc.


● Accept documents : protel autocad powerpcb orcad gerber or real board copy board

● Plate types: CEM-1, CEM-3 FR4, high TG materials;

● Largest board size : 600mm*700mm (24000mil*27500mil)

● Processing board thickness : 0.4mm-4.0mm (15.75mil-157.5mil)

● The highest processing layer : 16Layers

● Copper foil thickness : 0.5-4.0(oz)

● Product thickness tolerance: +/-0.1mm(4mil)

● Molding size tolerance : Computer milling: 0.15mm (6mil) Mold punching plate: 0.10mm (4mil)

● Minimum line width/pitch: 0.1mm (4mil) Line width control capability: <+-20%

● Minimum drilling hole diameter of finished product : 0.25mm (10mil)

● Finished hole size: 0.9mm (35mil)

● Finished hole tolerance: PTH: +-0.075mm (3mil)

● NPTH: +-0.05mm (2mil)

● Finished hole wall copper thickness : 18-25um (0.71-0.99mil)

● Minimum SMT patch spacing : 0.15mm (6mil)

● Surface Coating : Chemical Immersion Gold, Spray Tin, Nickel Plated Gold (Water/Soft Gold), Silk Rubber, etc.

● On-board solder mask thickness : 10-30μm (0.4-1.2mil)

● Peel strength : 1.5N/mm (59N/mil)

● Solder Mask Hardness : >5H

● Solder Resist Plug Capability : 0.3-0.8mm(12mil-30mil)

● Dielectric constant : ε= 2.1-10.0

● Insulation resistance: 10KΩ-20MΩ

● Characteristic impedance : 60 ohm±10%

● Thermal shock : 288°C, 10 sec

● Warpage of the finished board : < 0.7%

● Product applications: communications equipment, automotive electronics, instrumentation, global positioning systems, computers, MP4, power supplies, home appliances, etc.


PCB board material and parameter introduction

PCB circuit board material introduction: According to the brand quality level from bottom to top divided as follows: 94HB-94VO-22F-CEM-1-CEM-3-FR-4

Detailed parameters and uses are as follows:

94HB: Ordinary cardboard, not fireproof (lowest material, die punching, cannot be used as a power panel)

94V0: Flame-retardant cardboard (die punching)

22F: Single Half Fiberglass board (Die Punching)

CEM-1: single-sided fiberglass fiber board (must be drilled by computer, can not be punched)

CEM-3: double-sided half glass fiber board (in addition to double-sided cardboard is the lowest end of the double-sided material, a simple double-sided board can use this material, will be cheaper than the FR-4 5 ~ 10 yuan / square meter)

FR-4: Double-sided Fiberglass Board

 

Classification of flame retardant characteristics can be divided into 94VO-V-1 -V-2 -94HB four kinds

Prepreg: 1080 = 0.0712mm, 2116 = 0.1143mm, 7628 = 0.1778mm

FR4 CEM-3 are for sheet metal, fr4 is fiberglass board, cem3 is composite substrate board

Halogen-free refers to a substrate that does not contain halogens (such as Fluorine, bromine, iodine and so on), because bromine generates toxic gases when burned, and environmental protection is required.

Tg is the glass transition temperature, that's the melting point.

The circuit board must be flammable, cannot burn at a certain temperature, and can only be softened. The temperature point at this time is called the glass transition temperature (Tg point), and this value is related to the dimensional durability of the PCB board.

What are the advantages of high Tg PCB boards and the use of high Tg PCBs?

When the temperature rises to a certain threshold, the substrate of High Tg Printed Circuit Boards changes from a "glassy state" to a "rubbery state," and the temperature at that time is called the glass transition temperature (Tg) of the board. That is, Tg is the maximum temperature (° C.) at which the substrate maintains rigidity. That is to say, ordinary PCB substrate materials continue to produce softening, deformation, melting, etc. at high temperatures, and also show a sharp decline in mechanical and electrical properties. This affects the service life of the products. Generally, the Tg plate is 130. Above °C, high Tg is generally greater than 170 °C, medium Tg is greater than 150 °C; PCBs with Tg ≥ 170 °C are commonly referred to as high Tg printed boards; the Tg of the substrate is increased, and the heat resistance of the printed board is increased. Moisture resistance, chemical resistance, stability and other characteristics will be improved and improved. The higher the TG value, the better the temperature resistance of the sheet, especially in the lead-free process, high Tg applications are more; high Tg refers to high heat resistance. With the rapid development of the electronics industry, electronic products represented by computers, in particular, are moving towards higher functionality and higher levels of multi-layered development, and the higher heat resistance of PCB substrates is a prerequisite. The emergence and development of high-density mounting technologies represented by SMT and CMT have made PCBs increasingly inseparable from the substrate's high heat resistance in terms of small apertures, fine lines, and thinness.

Therefore, the difference between the general FR-4 and high Tg: At the same time under high temperature, especially after heat absorption, the mechanical strength, dimensional stability, adhesion, water absorption, thermal decomposition, thermal expansion, etc. There are differences in the situation, high Tg products are obviously better than ordinary PCB substrate materials.

PCB board knowledge and standards At present, China's extensive use of copper-clad board has the following types, its characteristics are as follows: type of copper-clad board, copper-clad board knowledge, copper-clad board classification methods are many. According to the different reinforcing materials of the board, it can be divided into five categories: paper base, glass fiber cloth base, composite base (CEM series), multi-layer base board and special material base (ceramic, metal core base, etc.). If the classification is based on different resin adhesives used on the board, common paper-based CCI. There are various types of phenolic resins (XPc, XxxPC, FR-1, FR-2, etc.), epoxy resins (FE-3), and polyester resins. The common glass fiber cloth-based CCL has epoxy resin (FR-4, FR-5), which is currently the most widely used type of glass fiber cloth base. In addition, there are other special resins (glass fiber cloth, polyamide fibers, non-woven fabrics, etc. as additional materials): Bismaleimide modified triazine resin (BT), polyimide resin (PI) Diphenylene ether resin (PPO), maleic anhydride imine-styrene resin (MS), polycyanate resin, polyolefin resin, etc. According to the classification of the flame retardancy of CCL, it can be divided into two types of flame-retardant (UL94-VO, UL94-V1) and non-flame-retardant (UL94-HB) board. In the past year or two, as more attention was paid to environmental protection issues, a new type of CCL that does not contain bromine in the flame-retardant CCL has been classified as a “green type flame retardant CCL”. With the rapid development of electronic product technology, there are higher performance requirements for CCL. Therefore, from the performance classification of CCL, it is divided into general performance CCL, low dielectric constant CCL, high heat resistance CCL (L of general board is above 150° C.), low thermal expansion coefficient CCL (usually used on package substrates ) And other types. With the development and continuous advancement of electronic technology, new requirements have been continuously put forward for printed circuit board substrate materials, thereby promoting the continuous development of the copper clad board standard. At present, the main criteria for substrate materials are as follows.

 

1 National Standards: China's national standards for substrate materials are GB/T 4721-47221992 and GB 4723-4725-1992. The copper-clad plate standard in China's Taiwan region is the CNS standard, which is based on the Japanese JIs standard. It was established in 1983.

2 International Standards: Japanese JIS Standards, American ASTM, NEMA, MIL, IPc, ANSI, UL Standards, British Bs Standards, German DIN, VDE Standards, French NFC, UTE Standards, Canadian CSA Standards, Australian AS Standards, FOCT Standards of the Former Soviet Union, International IEC Standards, etc.; Suppliers of PCB design materials are commonly used and commonly used: Shengyi, Jiantao, International, etc.

● Accept documents : protel autocad powerpcb orcad gerber or real board copy board

● Plate types: CEM-1, CEM-3 FR4, high TG materials;

● Largest board size : 600mm*700mm (24000mil*27500mil)

● Processing board thickness : 0.4mm-4.0mm (15.75mil-157.5mil)

● The highest processing layer : 16Layers

● Copper foil thickness : 0.5-4.0(oz)

● Product thickness tolerance: +/-0.1mm(4mil)

● Molding size tolerance : Computer milling: 0.15mm (6mil) Mold punching plate: 0.10mm (4mil)

● Minimum line width/pitch: 0.1mm (4mil) Line width control capability: <+-20%

● Minimum drilling hole diameter of finished product : 0.25mm (10mil)

● Finished hole size: 0.9mm (35mil)

● Finished hole tolerance: PTH: +-0.075mm (3mil)

● NPTH: +-0.05mm (2mil)

● Finished hole wall copper thickness : 18-25um (0.71-0.99mil)

● Minimum SMT patch spacing : 0.15mm (6mil)

● Surface Coating : Chemical Immersion Gold, Spray Tin, Nickel Plated Gold (Water/Soft Gold), Silk Rubber, etc.

● On-board solder mask thickness : 10-30μm (0.4-1.2mil)

● Peel strength : 1.5N/mm (59N/mil)

● Solder Mask Hardness : >5H

● Solder Resist Plug Capability : 0.3-0.8mm(12mil-30mil)

● Dielectric constant : ε= 2.1-10.0

● Insulation resistance: 10KΩ-20MΩ

● Characteristic impedance : 60 ohm±10%

● Thermal shock : 288°C, 10 sec

● Warpage of the finished board : < 0.7%

● Product applications: communications equipment, automotive electronics, instrumentation, global positioning systems, computers, MP4, power supplies, home appliances, etc.

rigid pcb, pcb circuit, pcb prototyping, copper pcb etching


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