PCB industry upgrade, market value rises

In April 2019, South Korea and the United States 5G mobile communications were launched one after another. Although the initial signal coverage rate was not satisfactory, it also indicated that the 5G era is coming. The next year and a half including the UK and China will continue to officially transfer 5G. The 5G business opportunity of one wavelength will be started.

5G mobile communication-derived PCB business opportunities can be roughly divided into several types. First of all, in terms of infrastructure, due to the physical characteristics of micro-waves, 5G requires 4 to 5 times the number of 4G base stations and a large number of small base stations; the mobile terminal is 5G. The change of the smart phone brings up the tide; then there will be a variety of switches, routers or home communication equipment updates, and finally a variety of 5G applications. Various types of system modules will require PCB support with different characteristics. If the market realizes the time point and size, the base station-derived PCB is the earliest and currently realized demand business opportunity, but the largest and most estimated. The eye-catching 5G business opportunity is still a smart phone that falls in 3 to 5 years.

In terms of 5G base stations, each 5G base station AAU has about 6 PCB (3 antennas and 3 RF terminals), DU has 3 28-layer high-speed circuit boards, and CU has 1 40-layer. Left and right high speed backplane. The number, materials and circuit board quotations built by the global base stations every year... It is estimated that the global 5G base station PCB market will be around US$1 billion in 2019, and it is expected to grow to US$8 billion in 2023. The PCB in the base station need high-frequency/high-speed material support. The development of related materials, but the right to use the materials is still in the hands of the end customers, so it has more advantages than Taiwan, and Taiwan Material Factory must be more likely to obtain the end user's willingness to use the verification platform and mechanism.

For PCB manufacturers, it is not the material that can be cut into the high-frequency/high-speed board market for 5G applications. In addition to material support, the high-frequency/high-speed board for PCB manufacturing in 5G environment needs to have thermal design and thin plates. Precision fine path and high impedance matching requirements, .. and other process capabilities. All in all, the 5G PCB supply chain is still not fully finalized from materials and equipment to the board factory. Any new materials and new processes may break the current supply chain system, and this is a great opportunity for many manufacturers to transform and upgrade.