What kind of PCB board can we make

 Layers

1-24 layers

Material

FR4，TG150， TG170, TG180, High frequency material, Ceramic material, Metal base material,Rigid-Flexible material

Thickness

0.1-6.5mm

Maximum single size

600mm*1200mm

The thickness of copper

the biggest thickness of the outer copper is 15oz,inner copper thickness is 12oz

Minimum hole diameter

0.1mm

Handling hole

Blind hole,buried hole,half hole,resin plug hole,sunk head hole, silver paste irrigation hole,copper pulp irrigation hole

the maximum thickness of copper

40um

The depth ratio of hole diameter

10:1

Minimum line width and line spacing

Sample 3/3Mil,mass production 3.5/3.5Mil

Line width tolerance

±20%

Minimum BGA ball

8MIL

The minimum spacing of BGA to line

6MIL

Minimum spacing between BGA and PAD

8MIL

Solder Mask dam

4MIL

The distance of inner hole to line

4 layers board 6mil,6/8 layers board 8MIL

warped degrees

≤0.75%

Impedance control

+/-%10

The test process

Rack test and flying needle test

Surface technical

Tin spray with lead, Tin spray without lead,Sink tin, Sink silver, Sink gold,Sink nickel palladium gold,Electric flexible gold,Electric rigid gold, gold finger, antioxidant

Gold thickness

140u’

Thickness of spray tin

1-40um

Resistance welding color

Green,White,Black, Yellow,Red

The order of blind buried holes

First order blind buried,2 order blind buried,3 order blind buried 

One-time electrical test direct pass rate

>99.5%(single-side board)，>98.5%( double-side board)，>97%(4 layers board)，>95%( 6 layers board)，>93.5%( 8 layers board)

Scrap rate

0.5%(single-side board），0.8%（double-side board），2%（4 layers board）,3%(6 layers board)，4-5%（8 layers board and above）

Others

Multilayer metal base board, aluminum foil FPC