PCBA board inspection project standard for SMT patch workshop

PCBA board inspection project standard for SMT patch workshop

01, SMT parts solder joint blank welding 

02, SMT parts solder joint cold welding: with toothpick gently pull the part pin, if can be moved, it is cold welding 

03, SMT parts (solder joint) short circuit (tin bridge) 

04, SMT parts missing parts 

05, SMT parts error 

06. SMT parts with polarity opposite or wrong causing combustion or explosion 

07, SMT parts 

08, SMT parts: text face down

09, SMT parts side stand: sheet element length ≤ 3mm, width ≤ 1.5mm not more than five Mi) 

10, SMT parts tombstone: the end of the chip element is raised 

11,SMT part foot offset: side offset less than or equal to 1/2 of solderable end width 

12, SMT parts floating height: distance from the bottom of the element to the substrate < 1mm SMT foot Gao Qiao: the height of lifting is greater than the thickness of the foot of the part The heel of SMT parts is not flat and tin is not eaten 

15, SMT parts can't be identified (print blur) 

16, SMT parts foot or body oxidation 

17, SMT parts body breakage: capacitance breakage; Resistance breakage is less than 1 / 4 of the width or thickness of the component; IC damaged in any direction of length < 1.5mm / min, revealing the inner material of MAM) 

18, SMT parts use non-designated suppliers: according to BOM,ECN 

19,Solder Tip of SMT parts: tin Tip height is larger than part body height 

20, SMT parts eat too little tin: minimum solder joint height less than solder thickness plus solderable end height of 25% or solder thickness plus 0.5mm, the smaller of which is SMT)

 21, SMT parts eat too much tin: maximum solder joint height over the pad or climb to the top of the metal coating end cap solderable end, solder contact element body MAA) 

22, tin ball / tin slag: more than 5 tin balls or solder splashes per 600 mm 2 or less) 

23, solder joint with pinhole / blow hole: one solder joint with more than one (including) 

24, Crystallization: on the surface of a PCB plate, there is white residue around a welding terminal or terminal, and a white crystal on a metal surface. 

25,The uncleanness of the plate: the uncleanness of the arm that cannot be detected within 30 seconds at a long distance is accepted. 

26,Poor dispensing: viscose is located in the area to be welded, reducing the width of the end to be welded by more than 50% 

27, PCB copper foil leather 

28, PCB exposed copper: wire (Goldfinger) exposed copper width greater than 0.5 mm 

29, PCB scratch: no substrate 

30,PCB coke yellow: PCB after welding furnace or maintenance, the roasted coke yellowed is not the same as the PCB color. 

31, PCB bending: bending in either direction with a deformation of more than 1 mm / 300mm) 

32, PCB inner layer separation (bubble):. Areas where foaming and delamination do not exceed 25% of the distance between coated holes or internal conductors; foaming between coated holes or internal conductors MAA) 

33, PCB with foreign bodies: conductive / non-conductive) 

34, PCB version error: according to BOMU ECN 

35, gold-finger tin-stained: tin-stained position falls on the edge of the board from 80% to 80%)