SMT TERM


AI :Auto-Insertion

AQL :acceptable quality level

ATE :automatic test equipment

ATM :atmosphere

BGA :ball grid array

CCD :charge coupled device

CLCC :Ceramic leadless chip carrier

COB :chip-on-board

cps :centipoises

CSB :chip scale ball grid array

CSP :chip scale package

CTE :coefficient of thermal expansion

DIP :dual in-line package

FPT :fine pitch technology

FR-4 :flame-retardant substrate

IC :integrate circuit

IR :infra-red

Kpa :kilopascals

LCC :leadless chip carrier

MCM :multi-chip module

MELF :metal electrode face

MQFP :metalized QFP

NEPCON :National Electronic Package and

Production Conference

PBGA:plastic ball grid array

PCB:printed circuit board

PFC :polymer flip chip

PLCC:plastic leadless chip carrier

Polyurethane

ppm:parts per million

psi :pounds/inch2

PWB :printed wiring board

QFP :quad flat package

SIP :single in-line package

SIR :surface insulation resistance

SMC :Surface Mount Component

SMD :Surface Mount Device

SMEMA :Surface Mount Equipment

Manufacturers Association

SMT :surface mount technology

SOIC :small outline integrated circuit

SOJ :small out-line j-leaded package

SOP :small out-line package

SOT :small outline transistor

SPC :statistical process control

SSOP :shrink small outline package

TAB :tape automaticed bonding

TCE :thermal coefficient of expansion

Tg :glass transition temperature

THD :Through hole device

TQFP :tape quad flat package

UV :ultraviolet

uBGA :micro BGA

cBGA :ceramic BGA

PTH :Plated Thru Hole

IA Information Appliance

MESH

OXIDE

FLUX

LGA (Land Grid Arry)

TCP (Tape Carrier Package)

ACF Anisotropic Conductive Film

Solder mask

Soldering Iron

Solder balls

Solder Splash

Solder Skips

Through hole

Touch up

Briding

Solder Wires

Solder Bars

Green Strength

Transter Pressure

Screen Printing

Solder Powder

Wetteng ability

Viscosity

Solderability

Applicability

Flip chip

Depaneling Machine

Solder Recovery System

Wire Welder

X-Ray Multi-layer Inspection System X-Ray

BGA Open/Short X-Ray Inspection Machine BGA X-Ray

Prepreg Copper Foil Sheeter P.P.

Flex Circuit Connections

LCD Rework Station

Battery Electro Welder

PCMCIA Card Welder PCMCIA

Laser Diode

Ion Lasers

Nd: YAG Laser

DPSS Lasers

Ultrafast Laser System

MLCC Equipment

Green Tape Caster, Coater

ISO Static Laminator

Green Tape Cutter

Chip Terminator

MLCC Tester

Components Vision Inspection System

High Voltage Burn-In Life Tester

Capacitor Life Test with Leakage Current

Taping Machine

Surface Mounting Equipment

Silver Electrode Coating Machine

TFT-LCD

STN-LCD

PDA

CMP

Compact Flash Memory Card

Dataplay Disk

 

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