Test Method and Standard for FPC flexible Circuit Board
The test range includes flexible circuit single-sided, double-sided and multi-layer boards. The flexible circuit board mentioned in this standard refers to single, double and multi-layer flexible copper foil substrates based on polyimide (PI) or polyester (PET), including glue (Adhesive, 3L). -FCCL) and Adhesive (2L-FCCL) flexible copper foil substrate. The purpose of the test is to establish a general rule for the appearance quality judgment of flexible circuit boards. As a basis for discriminating the appearance quality of soft board products between Tianpai Company and its suppliers, it is helpful to improve manufacturing technology and reduce unnecessary scrapping. Waste of resources and environmental pollution.The test method uses visual, magnifying glass and ruler as the main test methods and tools. If necessary, other applicable test instruments or equipment should be used for inspection.
Test basic standards:
1. The appearance of the film surface of the substrate;
2, the appearance of the cover layer;
3. Deviation between the lands and the cover layer;
4. Infiltration of the binder and the cover coating;
5, the conductor under the cover layer discoloration, after the temperature of 40 ° C, humidity 90%, 96 hours of moisture resistance test, must still meet the requirements of withstand voltage, bending resistance, bending resistance, welding resistance;
6. Leakage coating of the coating layer;
7, poor plating and bonding.
Note: Flexible circuit board (hereinafter referred to as: FPC) storage period description:
The bare part of the FPC conductor needs to be treated with surface plating (rustproof), such as plating, gold, OSP, tin plating, etc. The storage environment should be protected from corrosive gases, and the temperature should be controlled at 20 +/- 5 degrees Celsius and the relative humidity should be controlled below 70% R.H. Under the storage conditions of the product above, the effective shelf life is 6 months after leaving the factory.