The basic noun explanation for SMT
Accuracy: The difference between the measurement result and the target value.
Additive Process: A method of making PCB conductive traces by selectively depositing conductive materials (copper, tin, etc.) on the plies.
Adhesion: Similar to the attraction between molecules.
Aerosol: A liquid or gas particle that is small enough to be airborne.
Angle of attack: The angle between the screen print surface and the screen print surface.
Anisotropic adhesive: A conductive substance whose particles pass current only in the Z-axis direction.
Annular ring: A conductive material around the borehole.
Application specific integrated circuit: A circuit that is custom made for a specific purpose.
Array: A set of elements, such as: solder balls, arranged in rows and columns.
Artwork: A conductive wiring diagram of a PCB used to produce a photo original, which can be made in any ratio, but is typically 3:1 or 4:1.
Automated test equipment: In order to evaluate performance levels, equipment designed for automatic analysis or static parameters is also used for fault isolation.
Automatic optical inspection: On an automated system, use a camera to inspect a model or object.
Ball grid array: A form of packaging for an integrated circuit whose input and output points are solder balls arranged in a grid pattern on the underside of the component.
Blind via: An electrically conductive connection between the outer and inner layers of the PCB that does not continue to the other side of the board.
Bond lift-off: A failure to separate solder pins from the pad surface (board substrate).
Bonding agent: A glue that bonds a single layer to form a multilayer board.
Bridge: A solder that connects two conductors that should be electrically connected to each other, causing a short circuit.
Buried via: An electrically conductive connection between two or more inner layers of a PCB (ie, invisible from the outer layer).
CAD/CAM system: Computer-aided design uses specialized software tools to design printed circuit structures; computer-aided manufacturing converts this design into actual products. These systems include large-scale memory for data processing and storage, input for design creation, and output devices for converting stored information into graphics and reports.
Capillary action: A natural phenomenon in which molten solder flows against solid surfaces that are close to each other against gravity.
Chip on board: A hybrid technology that uses chip components that are glued face up, traditionally connected to the base layer of the board by flying leads.
Circuit tester: A method of testing a PCB during mass production. Includes: needle bed, component lead footprints, pilot probes, internal traces, loading plates, empty plates, and component testing.
Cladding: A thin layer of metal foil bonded to the board layer to form PCB conductive traces.
Coefficient of the thermal expansion: When the surface temperature of the material increases, the measured mass per unit of temperature expands in parts per million (ppm).
Cold cleaning: An organic dissolution process in which liquid contact completes the residue removal after soldering.
Cold solder joint: A solder joint that reflects insufficient wetting. It is characterized by a grayish and porous appearance due to insufficient heating or improper cleaning.
Component density: The number of components on the PCB divided by the area of the board.
Conductive epoxy: A polymeric material that passes an electric current by adding metal particles, usually silver.
Conductive ink: A glue used on thick film materials to form a PCB conductive wiring pattern.
Conformal coating: A thin protective coating applied to PCBs that conform to the assembled shape.
Copper foil: A thin, continuous metal foil deposited on the base layer of a circuit board as an electrical conductor of a PCB. It is easy to adhere to the insulating layer, accepts a printed protective layer, and forms a circuit pattern after etching.
Copper mirror test: A flux corrosion test in which a vacuum deposited film is used on a glass plate.
Cure: A change in the physical properties of a material, either by chemical reaction or by a pressure/pressureless reaction to heat.
Cycle rate: A component patch noun used to measure the speed of a machine from picking, positioning, and returning, also known as test speed.