The bulk density of Ceramic PCB

Aluminum nitride ceramic substrate as a circuit component and interconnect carrier, widely used in military and space technology communications, computers, instrumentation, power electronic equipment, automobiles, household appliances, office automation and other fields. Such as LED lighting circuit, ignition module, thyristor heat dissipation, high power module circuit, thyristor rectifier, high power transistor, semiconductor laser, solid state relay, switching power supply, high power integrated circuit and package on.

The bulk density (g / cm3) was 3.29