The difference between lead-spray tin and lead-free paint of PCB board
The process requirements in PCB production are an important factor, and he directly determines the quality and positioning of the board.
Today, I will detail the difference between lead tin and lead-free tin for your reference.
1. From the surface of tin, lead tin is brighter and lead-free tin (SAC) is darker. Lead-free penetration is worse than lead.
2.Lead in lead is harmful to humans but not harmful to lead. The lead eutectic temperature is lower than lead-free. Specifically, it depends on the composition of the lead-free alloy. A eutectic like SNAGCU is 217 degrees and the soldering temperature is eutectic temperature plus 30 to 50 degrees. It depends on the actual adjustment. The lead eutectic is 183 degrees. Lead in mechanical strength, brightness, etc. is superior to lead-free.
3. The lead content of lead-free tin does not exceed 0.5, and the lead content reaches 37.
4. lead will increase the activity of tin wire during the welding process, the wire is relatively better than the lead-free tin wire, but the lead is toxic, long-term use is unfavorable to the human body, and the melting point of lead-free tin is higher than that of lead-tin. This makes the solder joints stronger.
What is the difference between lead-free and lead-spray on PCB? How many degrees now?
1. PCB lead-free spray tin is environmentally friendly, does not contain harmful substances "lead", melting point is about 218 degrees; soldering furnace temperature needs to be controlled at 280-300 degrees; over-peak temperature needs to be controlled at about 260 degrees; over-current temperature 260-270 degrees.
2.PCB board lead spray tin does not belong to environmental protection "lead" containing harmful substances, melting point of about 183 degrees; tin furnace temperature should be controlled at 245-260 degrees; over-peak temperature needs to be controlled at about 250 degrees; temperature 245-255 degrees.