The difference between Prepreg and Core
The Prepreg is an insulating material for the PCB. Prepreg is not prepreg before being laminated, also known as prepreg,prior to lamination, and is primarily used as a bonding material and an insulating material for the inner conductive pattern of a multilayer printed circuit board. After the Prepreg is laminated, the semi-cured epoxy is extruded, begins to flow and solidifies, bonds the multilayer sheets together and forms a reliable insulator.
The Core is the basic material for making printed circuit boards. The Core is also known as the core board, which has a certain hardness and thickness, as well as double bread copper. Therefore, the multi-layer board is actually a combination of Core and Prepreg. The difference between the two:
1, prepreg is a material in the PCB, the former material is semi-solid, similar to cardboard, the latter is hard, similar to copper;
2, prepreg is similar to adhesive + Insulator; and the core is the basic material of the PCB, two are completely different functions;
3, the prepreg can be curled, the core can not be bent; 4, the prepreg is not conductive, the copper layer on both sides of the core, is the printed circuit board Conductive medium.