The difference between Via and Pad in PCB design
The via is called a via, and has a through hole, a blind hole and a buried hole. It is mainly used for the connection of wires of different layers in the network, and cannot be used as a plug hole welding component.
The via hole is not controlled by the aperture during the production process (JLC does not currently process blind holes and buried holes, only through holes are produced)
The pad is called the pad, and has the pin pad and the surface mount pad; the pin pad has a solder hole, which is mainly used for soldering the pin component; and the surface mount pad has no solder hole, and is mainly used for soldering the surface mount component.
The Pad hole is controlled by the aperture during the production process with a tolerance of plus or minus 0.08mm.
Via mainly plays the role of electrical connection. In actual production, it may compensate for the production of enlarged holes and close-knit knives, reduce the number of knives and improve work efficiency, and may also be due to line spacing.
The space is limited to reduce the aperture to meet production. Via's aperture is generally small, usually as long as the board processing process can be done.
The via surface can be coated with or without soldering ink; the pad not only functions as an electrical connection, but also acts as a mechanical anchor. The aperture of the pad must be large enough to
Pass through the components of the component, otherwise it will cause production problems; in addition, the pad surface must not have solder mask ink, because this will affect the soldering, hole tolerance control is plus or minus 0.08mm or larger or smaller
Will result in a weak installation.