The role and principles of PCB copper coating

Copper clad has a very important position in the PCB production process. Sometimes the success or failure of copper clad is related to the quality of the whole board. The so-called copper clad is to fill the unused space on the PCB substrate with solid copper.

Copper clad has two methods: large-area copper clad and grid copper clad. Large-area copper clad increases current and shielding, but if wave soldering is performed, the board may pick up or even blistering. Grid copper can reduce the copper heating surface, but also play a role in electromagnetic shielding. However, the grid is composed of traces. If the traces are not wide enough, interference signals will be generated.

Copper has many benefits for PCBs, such as improving noise immunity, reducing potential difference, reducing ground impedance, improving anti-jamming capability, reducing voltage drop, improving power efficiency, connecting to ground, reducing loop area, and dissipating heat , Reduce the impedance. Since copper has so many benefits, what should we pay attention to during operation?

1. If there are many PCBs with SGND, AGND, GND, etc., use the most important “ground” as a reference for independent copper plating.

2. The crystal oscillator in the circuit is a high-frequency emission source. The copper coating in the vicinity thereof surrounds the crystal oscillator, and then the shell of the crystal oscillator is additionally grounded.

3. Do not appear sharp corners, that is more than 180 °, otherwise it will constitute a transmitting antenna.