Thermoelectric separation process technology for copper substrates

Thermoelectric separation substrate: the circuit part and the thermal layer part of the substrate are on different circuit layers, and the thermal layer part directly contacts the heat dissipation part of the lamp bead to achieve the best heat conduction and heat conduction (zero thermal resistance), generally a copper substrate.

The thermoelectric separation of the copper substrate means that the production process of the copper substrate is a thermoelectric separation process, wherein the substrate circuit portion and the thermal layer portion are on different circuit layers, and the thermal layer portion directly contacts the heat sink portion of the lamp bead to achieve the best heat dissipation. Thermal conduction (zero thermal resistance).

Advantages: 1. The copper substrate is selected, the density is high, the substrate itself has strong heat carrying capacity, and the heat conduction and heat dissipation are good.

      2. The thermoelectric separation structure is adopted, and the lamp bead is in contact with zero thermal resistance. The biggest reduction in lamp bead fading extends the life of the lamp bead.

      3. The density of the copper substrate is high, and the heat carrying capacity is strong, and the volume is smaller under the same power.

      4. Suitable for matching single high-power lamp beads, especially COB package, to achieve better results.

      5. According to different needs, various table treatments (immersion gold, OSP, spray tin, silver plating, immersion silver + silver plating) can be carried out, and the surface treatment layer has excellent reliability.

      6. Different structures can be made according to the different design needs of the lamps (copper bumps, copper bumps, thermal layers and circuit layers are parallel).

Disadvantages: Not applicable to single crystal chip bare crystal package.

PCB thermoelectric separation copper substrate process technical steps:

1. First, the copper foil substrate is cut to a size suitable for processing.

2. Note that before the substrate is pressed, the copper foil on the copper surface is usually roughened by brushing and micro-etching.

3. The dry film resist is adhered to the photoresist at an appropriate temperature and pressure. The photoresist is generated after the ultraviolet light is irradiated in the transparent region of the film (the dry film in the region is later developed and copper-etched). The center will be retained as an etch stop), and the line image on the film will be transferred to the dry film photoresist on the board.

4. After the protective film on the film surface is torn off, the unexposed area on the film surface is developed and removed with an aqueous solution of sodium carbonate, and the exposed copper foil is etched away with hydrochloric acid and a mixed solution of hydrogen peroxide to form a line.

5. Finally, the dry film photoresist that has been retired is washed away with an aqueous solution of sodium hydroxide. For the inner layer circuit board of six or more layers, the riveting reference hole for the alignment of the interlayer line is automatically positioned by the punching machine.