Through hole electroplating method in circuit board

                                        Through hole electroplating method in circuit board


        In the through hole electroplating, there are many ways to establish a suitable electroplating layer on the hole wall of the substrate drilling hole, which is called hole wall activation in industrial application. Many intermediate storage tanks are needed in the commercial production process of the printed circuit. Each tank has its own control and maintenance requirements.


        Through hole electroplating is the necessary process in the drilling process. When the drill bit is drilled through the copper foil and the substrate under it, the heat generated will melt the insulating synthetic resin which constitutes the substrate of most of the substrates. Molten resin and other drilling debris accumulate around the holes and are coated on newly exposed walls of copper foil.


         In fact, this is harmful to the subsequent electroplating surface, the molten resin will also remain on the substrate hole wall under a hot axis, it has shown bad adhesion to most activators. This requires the development of another technology similar to decontamination and backwash chemistry: ink!


         The ink is used to form a highly adhesive and electrically conductive coating on each through-hole inner wall, so that there is no need to use multiple chemical processes, only one application step, followed by heat-curing. This ink is a resin-based substance and has a strong adhesion. Can be easily bonded to the wall of most hot-polished holes, thus eliminating the step of back etching.