Why use red glue for SMT processing

The paste processing adhesive is a patch processing red glue, usually a red (also yellow or white) paste, which is uniformly distributed with a hardener, a pigment, a solvent, and the like mainly used for the patch.

The processing components are attached to a printed circuit board and are typically dispensed by dispensing or stencil printing. After the components are joined, they are placed in an oven or a reflow oven for heat hardening.

The paste processing paste adhesive is cured after heating, and the curing temperature of the patch processing is usually 150 degrees, and the heat is insoluble, that is, the heat hardening process of the patch processing is irreversible. Patch plus

The effect of the work can vary depending on the heat curing conditions, the connected objects, the equipment used and the operating environment. The patch adhesive is selected according to a printed circuit board assembly (PCBA processing) process.


The patch processing red glue is a compound whose main component is a polymer material. Patch processing fillers, curing agents, other additives, etc. SMD processing of red plastic with viscosity flow, temperature characteristics, wettability

Features, etc. According to the characteristics of red rubber processing, in the production, the purpose of using red plastic is to make the parts firmly adhere to the surface of the PCB to prevent it from falling.

SMD processing is a purely consumable material and is not a required processing product. With the continuous improvement of surface mount design and process, through-hole reflow soldering and double-sided reflow soldering have been realized.

Today, there are fewer and fewer installation processes for patch adhesives.