5G Communication Challenges To PCB Technology

Material requirements: A very clear direction for 5G PCB is high-frequency high-speed materials and boards. In terms of high-frequency materials, it can be clearly seen that traditional high-speed materials manufacturers have begun to lay out high-frequency plates and introduced a series of new materials. This will break the current situation of the Rogers family in the field of high-frequency panels. After benign competition, the performance, convenience and availability of materials will be greatly enhanced. Therefore, the localization of high-frequency materials is an inevitable trend.


In terms of high-speed materials, 400G products require M7N and MW4000 equivalent materials. In the backplane design, the M7N is already the lowest loss option, and future larger capacity backplane/optical modules require lower loss materials. The combination of resin, copper foil and glass cloth will achieve the best balance between electrical performance and cost. In addition, high-level numbers and high density also pose reliability challenges.


Requirements for PCB design: The selection of the board should meet the requirements of high frequency and high speed. The impedance matching, stacking planning, wiring spacing/hole, etc. should meet the signal integrity requirements, which can be from loss, embedding, high frequency phase. /Stop, mix, heat, PIM these six aspects.

Requirements for process technology: Wu Jun believes that the enhancement of the functions of 5G related applications will increase the demand for high-density PCBs, and HDI will become an important technical field. Multi-order HDI products and even any order interconnect products will be popularized, and new processes such as buried resistance and buried capacity will have more and more applications.


The copper thickness uniformity of the PCB, the accuracy of the line width, the alignment between the layers, the thickness of the interlayer dielectric, the control precision of the back drilling depth, and the plasma de-staining ability are all worthy of further study.


Requirements for equipment and instruments: Wu Yuanli pointed out that high-precision equipment and pre-treatment lines with less copper surface roughening are currently ideal processing equipment; and test equipment has passive intermodulation tester, flying needle impedance tester, and loss. Test equipment, etc.


Precision graphics transfer and vacuum etching equipment, real-time monitoring and feedback data change line line width and coupling spacing detection equipment; uniformity of the plating equipment, high-precision lamination equipment, etc. can also meet the 5G PCB production needs.

Requirements for quality monitoring: Due to the increase of 5G signal rate, the influence of board deviation on signal performance becomes larger, which requires more strict control of production deviation of the board, and the existing mainstream board process and equipment update is not large. Will become the bottleneck of future technological development. How to break the PCB manufacturing company is crucial.


In quality control, Jin Baize further strengthens the statistical process control of key product parameters, and needs to manage the data more in real time, so that the consistency of the product is guaranteed to meet the performance requirements of the antenna in terms of phase, standing wave and amplitude.