5G Drives High-speed Copper Laminate Industry Growth

Copper-clad board (CCL), also known as the substrate, is the upstream basic material of the PCB, accounting for about 35% of the PCB cost. 5G boosts the demand for high-frequency and high-speed sheet materials, and the market space is 8 times that of 4G, with about 35 billion market space.


Because 5G requires higher transmission bandwidth and delay than 4G, and MassiveMIMO multi-antenna technology requires higher integration of 5G base stations, plus 5G frequency bands and future millimeter wave frequency bands are higher than 4G, so the base station RF front-end Increasing a large amount of high-frequency and high-speed copper-clad laminates. According to estimates by Guohai Securities, 5G's demand for PCB boards at the base station side will reach 100 billion, and the market space for high-frequency and high-speed copper-clad laminate materials required will reach about 35 billion.


At the same time, driven by trade frictions, major communication equipment manufacturers urgently need to break through the bottleneck of localization. The company actively invests in research and development, and continues to develop and test. The high-frequency and high-speed boards submitted are expected to obtain final certification and get commercial orders. At the same time, the industry has high barriers, fewer short-term competitors, and a strong pattern advantage.