Challenges Of 5G Communication To PCB Technology

5G communication is a huge and complex integration technology, and its challenges to PCB process mainly focus on: large size, high multi-layer, high frequency, high speed, low loss, high density, rigid flexural combination, high and low frequency mixed pressure and other aspects. With so many new or higher requirements for PCB materials, design, processing and quality control, PCB enterprises need to understand the changing requirements and propose comprehensive solutions.

 

Material requirements: a very clear direction of 5G PCB is high frequency and high speed material and plate making. The localization of high frequency materials is an inevitable trend.

 

Requirements for PCB design: the selection of board shall meet the requirements of high frequency and high speed, and impedance matching, cascade planning, wiring spacing/hole, etc. shall meet the requirements of signal integrity, which can be started from the six aspects of loss, embedding, high frequency phase/amplitude, mixed pressure, heat dissipation and PIM.

Requirements for process technology: the improvement of 5G related application products' functions will increase the demand for high-density PCB, and HDI will also become an important technical field. Multi-order HDI products or even products of arbitrary order interconnect will be popular, and new processes such as buried resistance and buried capacity will also have more and more applications.

 

PCB copper thickness uniformity, line width accuracy, interlayer alignment, interlayer media thickness, back drill depth control precision, plasma drilling ability are worth further research.

 

Requirements for equipment and instruments: high-precision equipment and pre-processing line with less coarsening of copper surface are ideal processing equipment at present; And the test equipment is no source intermodulation tester, flying pin impedance tester, loss test equipment.

 

Precision graphics transfer and vacuum etching equipment, real-time monitoring and feedback of data changes in line line width and coupling spacing detection equipment; Electroplating equipment with good uniformity and high-precision laminating equipment can also meet the production requirements of 5G PCB.

Requirements for quality control: due to the improvement of 5G signal rate, the deviation of plate making has a greater impact on signal performance, which requires more strict control of production deviation of plate making. However, the current mainstream plate making process and equipment are not updated much, which will become the bottleneck of future technological development. PCB manufacturers how to break the board, is crucial.

 

In terms of quality monitoring, it is necessary to strengthen the statistical process control of key product parameters and more real-time management data, so as to ensure the consistency of products and meet the performance requirements of antenna in aspects of phase, standing wave and amplitude.