Pre - Requisite Component Package Knowledge Of Engineer

          Pre - requisite Component Package Knowledge of Engineer

Encapsulation has largely evolved through the following processes: 

Structure: TO- > DIP- > PLCC- > QFP- > BGA-> CSP-; Materials: metal, Ceramics > Ceramics, Plastics-> Plastics; Pin shape: long lead straight insertion-> short lead or no lead mount-> spherical convex dot; Mounting and matching: through hole insertion-> surface assembly-> direct installation of specific packaging form.


1, SOP/SOIC package
SOP is the abbreviation of Package Outline Small English, namely small outline package.SOP package technology from 1968 to 1969, Philip successfully developed, then gradually derived SOJ (J type pin small outline package), TSOP (thin small outline package), VSOP (small outline package), SSOP (SOP, TSSOP (9) the compact SOP thin) and SOT (small outline transistor), SOIC (SOIC).


2, DIP package
DIP is the abbreviation of In-linePackage Double English, namely dual in-line package. Cartridge type package of pin drawn from the package on both sides, packaging materials are plastic and ceramic.DIP two is the most popular plug-in type package, including the application of standard logic IC, memory LSI, microcomputer circuit.


3, PLCC package

PLCC is the abbreviation of Plastic Leaded Chip Carrier. 32-pin package, with pin around, the shape size is much smaller than DIP package. PLCC package suitable for SMT surface installation technology on the PCB installation wiring, with a small shape size. The advantage of high reliability.


4, TQFP package

TQFP is the abbreviation of English thin quad flat package, that is, the thin plastic seal quadrangular flat package. The quadrilateral flat package can effectively utilize the space. Because of the reduction of the height and volume product, this packaging technology is very suitable for the application of higher space requirements. For example, PCMCIA card and network device. Almost all ALTERA CPLD/FPGA have TQFP package.



5, PQFP package

PQFP is the abbreviation of Plastic Quad Flat Package, that is, the pin distance is very small and the pin is very thin. Generally large-scale or very-scale integrated circuits in this form of packaging, the number of pins are generally more than 100.


6, TSOP package

TSOP is the abbreviation of Thin Small Outline Package. A typical feature of the thin, small-size packaging. TSOP memory packaging technology is to make pins around the packaging chip. TSOP is suitable to use SMT technology (surface mounting technology) to install wiring on printed circuit board. TSOP package size, parasitic parameters (when the current is greatly changed. It is suitable for high frequency application, easy to operate and high reliability.


7, BGA package
BGA is the abbreviation of English Ball Grid Array Package, that is, the grid array package.


The memory encapsulated by BGA technology can increase the memory capacity by two to three times under the condition of constant internal volume. Compared with TSOP, it has a smaller volume. Better heat dissipation and electrical performance. BGA packaging technology has greatly improved the storage capacity per square inch, and memory products using BGA packaging technology at the same capacity. The volume of TSOP package is only 1/3; In addition, compared with the traditional TSOP packaging, the TSOP packaging has a faster and more effective way of heat dissipation.


The I/O terminal of BGA package with round or columnar joints according to the array distribution in the package below, the advantages of BGA technology is I/O pin although the number has increased, but the pitch was not reduced but increased, thereby improving the assembly yield; although its power increases, but BGA welding controlled collapse chip method. Thus it can improve heating performance; the thickness and weight than the previous packaging technology has decreased; the parasitic parameter decreases, signal transmission delay, frequency of use is greatly improved; the assembly can be coplanarwelding high reliability.


In the case of the same capacity , TinyBGA package technology has only 1 / 3 of TSOP package . TinyBGA is leaded by the center of the chip . This method effectively shortens the conduction distance of the signal , and the length of the signal transmission line is only 1 / 4 of the traditional TSOP technology , so the attenuation of the signal is reduced . This not only greatly improves the anti - interference and anti - noise performance of the chip , but also improves the electrical performance . TinyBGA package chip can resist external frequency up to 300MHz , while the traditional TSOP package technology can only resist the external frequency of 150MHz .


 TinyBGA packages have thinner memory ( less than 0.8mm in package height ) , only 0.36 mm from the effective heat dissipation path from the metal substrate to the heat sink . Therefore , TinyBGA memory has higher heat transfer efficiency and is very suitable for long - running systems with excellent stability .