Introduction To The Difference In Characteristics Between PCB And FPC

In fact, FPC is not only a flexible circuit board, but also an important design method for establishing a body circuit structure. This structure can be combined with other electronic product designs to construct a variety of different applications. Therefore, from this point Look, FPC is very different from hard board. For a hard board, unless the line is made in a three-dimensional form by means of a film glue, the board is generally flat in general. Therefore, to make full use of the three-dimensional space, FPC is a good solution. In terms of hard boards, the current space extension scheme is to use slots and interface cards, but the FPC can make a similar structure with the transit design, and the directional design is also more flexible. With a piece of connected FPC, two hard boards can be connected into a set of parallel line systems, or they can be turned into any angle to suit different product shapes.

FPC can of course be connected by terminal connection, but soft and hard boards can also be used to avoid these connection mechanisms. A single FPC can configure many hard boards and connect them by layout. This approach eliminates connector and terminal interference and improves signal quality and product reliability. The figure shows the hard and soft boards of multiple hard boards and FPC architecture. FPC can make the thinnest circuit board because of its material properties, and thinning is one of the most important demands of the electronics industry. Because FPC is made of thin film materials, it is also an important material for thin design in the electronics industry in the future. Due to the poor heat transfer properties of plastic materials, thinner plastic substrates are more advantageous for heat dissipation. Generally, the gap between FPC thickness and hard board is more than tens of times, so the heat dissipation rate is tens of times. Soft boards have such characteristics, so many high-wattage parts FPC assembly products will be attached with metal plates to improve heat dissipation. One of the important features of FPC is that when the solder joint distance is close and the thermal stress is large, the stress damage between the contacts can be reduced due to the elastic properties of the FPC. This advantage is especially reduced for some surface mounts that absorb their thermal stress.