IPC PCB Technology Trend Report Details PCB Manufacturers' Response Strategies
IPC—International Association of Electronics Industry Association® has newly released the Survey Report on PCB Technology Trends 2018. The report details how PCB manufacturers are responding to current technology needs to meet technological changes through 2023.
This report comes from PCB technology submitted by 74 companies around the world and data on OEM company demand for PCB as of 2018, OEM companies' application of emerging technologies, and industry forecasts for the next five years. The full text is 213 pages.
OEM companies' application data on emerging technologies shows that more than half of the companies are adopting IoT technology, and three-quarters of companies rely on sensors in the production of their products. By 2023, it is expected that more than half of the OEM companies will use artificial intelligence, and more than one third of the company's products will realize human-machine exchange through neural networks.
It is interesting that there are regional differences in blind hole technology. Blind holes are more common in OEM companies in North America and Europe than in Asian companies. PCB companies adopting stacked via technology are more common in Asia. More and more PCB companies adopting stacked via technology worldwide have a tendency to replace staggered vias. Asian PCB companies are the first to adopt printed electronics technology and are expected to see growth worldwide by 2023.
The data about the PCB in the report includes thickness, number of layers, density, line width and clearance, via hole diameter, aspect ratio, I / O pitch, hole design, blind and buried holes, thermal characteristics, etc., rigid board, flexible Materials, loss and surface treatment of flexible substrates and metal substrates, application of embedded components and chip packaging technology, printed electronics technology, 3D printing and electronic fabric technology. Participating companies also submitted their views on compliance and technical difficulties and trends. In addition, the data in the report is divided into two categories by region: North America and Europe, Asia, and products are divided into two categories: fixed installation and mobile.