IPC Releases PCB Technology Trend Report
IPC-International Electronics Industry Association released the "2018 PCB Technology Trend Research Report". The report details how PCB manufacturers respond to current technology needs to meet technological changes in 2023.
The report comes from PCB technology submitted by 74 companies around the world, as well as OEM demand for PCBs in 2018, OEM applications for emerging technologies, and industry forecasts for the next five years, 213 pages in full.
OEM data for emerging technologies shows that more than half of companies use IoT technology and three-quarters of companies rely on sensors for production. By 2023, more than half of OEM companies are expected to use artificial intelligence, and more than one-third of the company's products will be human-machine exchanged via neural networks.
Interestingly, there are regional differences in blind hole technology, which is more common in OEM in Asia and Europe than in Asian companies. PCB companies using laminated via technology are more common in Asia. More and more PCB companies are using laminated through-hole technology worldwide, and there is a tendency to replace staggered holes. Asia's PCBs are the first to adopt printed electronics technology and are expected to grow globally by 2023.
The data on the PCB in the report includes thickness, layer number, density, line width and gap, through hole aperture, aspect ratio, I/O pitch, hole design, blind and buried holes, thermal characteristics, etc., rigid plate, scratch material Metal substrate materials, loss and surface treatment, embedded component and chip packaging technology applications, printed electronics and 3D printing and electronic fabric technology. The companies involved in the survey also submitted comments on compliance, technical challenges and trends. In addition, the data in the report is divided into two categories according to regions: North America and Europe, Asia, and products are classified as fixed installation and mobile.