PCB And IC Carrier Board Development

Technical barriers are much higher than ordinary PCB, and there are fewer industry players.

 

The IC carrier board is developed on the basis of the HDI board, and there is a certain correlation between the two, but the technical threshold of the IC carrier board is much higher than that of the HDI and the ordinary PCB. High technical requirements and numerous patent restrictions have created a high threshold for the IC carrier industry, and the industry's threshold includes financial barriers, customer barriers and environmental barriers. These requirements make the IC carrier industry players scarce.

 

IC carrier boards are used in a wide range of applications.


The mainstream package substrate products are roughly divided into five categories, namely, a memory chip package substrate, a MEMS package substrate, a radio frequency module package substrate, a processor chip package substrate, and a high-speed communication package substrate. These chips have been basically adopted due to high integration. As the substrate packaging scheme continues to increase, the proportion of other chips using IC carrier boards will become higher and higher.

The global PCB industry has grown steadily, and the proportion of IC carriers has increased rapidly.

 

According to Prismark data, the global PCB production value in 2018 is about 62.396 billion US dollars, a year-on-year increase of 6%. The global PCB production value growth rate is about 3.2% in 2017-2022. The entire PCB industry has maintained steady growth in recent years. The IC carrier board has increased rapidly since 2017, and its share has increased from 12.12% in 2016 to 20% in 2018, an increase of nearly 8 percentage points. The increase in demand includes the demand for automotive electronics and personal terminals, but More importantly, it is affected by the memory chip boom cycle.

 

The market concentration is high and the potential for domestic substitution is large.

 

IC carrier board technology originated in Japan, and later Korea and China Taiwan have risen one after another, and the final industry pattern has become the three pillars of Japan, South Korea and Taiwan. According to Prismark data, the world's top 10 IC carrier companies accounted for more than 80% of total output value, and the industry concentration is extremely high. The time for domestic IC carrier board companies to get involved in IC carrier board is basically after 2005, and it is a "up-and-coming star" in the entire IC carrier board industry. Although China's IC carrier board industry started late, but benefited from the global PCB production capacity transfer to China and the rise of China's semiconductor packaging and testing and electronics manufacturing industry, the industry development is in an accelerated stage, and the future development potential is great.

The share in the PCB market continues to increase, and the development prospects at home and abroad are good.

 

The market share of IC carrier boards in the PCB has rapidly increased from 12.12% in 2016 to 20% in 2018, an increase of nearly 8 percentage points. From a global perspective, the increase in the size of high-performance chips is the trend of the times. The demand for the IC carrier board market will continue to grow with the increase in chip size. From the perspective of China, the expansion of domestic fabs has brought huge amounts to the industry. Incremental space, coupled with the domestic alternative market, the domestic IC chip leader is expected to fully benefit.