Process Of PCB Multilayer Board Compression (9)
Process of PCB multilayer Board Compression (9)
Before the multilayer circuit board or substrate is pressed, all kinds of loose material and steel plate, such as inner laminate, film and copper skin, Kraft paper pad, etc., should be aligned, leveled, or aligned with each other. This kind of preparatory work is called Lay Up. in order to improve the quality of the multilayer, not only the superposition is done in a clean room controlled by temperature and humidity, but also for the speed and quality of mass production. In general, mass Lamps are used for construction under eight storeys, and automatic superposition is even needed to reduce human error. In order to save plant and equipment, In general factories combine laminated and folded plates into a comprehensive processing unit, so the automation project is quite complex.
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