How do we guarantee the quality of SMT patches and solder paste printing?(2)

How do we guarantee the quality of SMT patches and solder paste printing?(2)


Fourth, the main factors leading to the overall deviation of solder paste printing:

1. The positioning reference point on the board is not clear.

2. The positioning reference point on the board is not aligned with the reference point of the template.

3. The fixed clamping of the circuit board in the printing press is loose. The position thimble is not in place.

4. The optical positioning system of the printing press is faulty.

5. The lack of template openings in the solder paste does not match the PCB design file.

Fifth, the main factors leading to the tip of printed solder paste:

1. Solder paste viscosity and other performance parameters are problematic.

2. 2. There is a problem with setting the demolding parameters used to separate the board from the missing printed circuit board.

3. There are burrs on the template hole wall of the template.

Sixth, patch quality analysis:

1. Common quality issues with SMT patches are leaks, side parts, parts, offsets and wear and tear.

Seven, the main factors that lead to patch leakage:

1. The component feeder is not in place.

2. The air inlet of the component nozzle is blocked, the nozzle is damaged, and the nozzle height is incorrect.

3. The vacuum path of the device is faulty and blocked.

4, the board is poorly received, resulting in deformation.

5. There is no solder paste or solder paste on the PCB pads.

6, component quality problems, the thickness of the same variety is inconsistent.

7. The patch caller has an error or omission, or the thickness parameter of the selected component is incorrect during programming.

8. Human factors were accidentally eliminated.

Eight, the main factors leading to SMC resistor patch, on the one hand:

1. The component feeder (feeder) is abnormal.

2. The height of the picking head is incorrect.

3. The height of the picking head is incorrect.

4. The size of the loading hole of the component tape is too large, and the component is turned over due to vibration.

5. When the bulk material is placed in the braid, the direction is reversed.

Nine, the main factors leading to component patch deviation:

1. When programming the placement machine, the X-Y axis coordinates of the component are incorrect.

2, the reason for the patch nozzle, so that the suction is unstable.

Ten, main factors causing damage during component placement:

1. The positioning thimble is too high, causing the board to be too high and the components are squeezed during the installation process.

2. When programming the placement machine, the Z coordinate of the component is incorrect.

3. The nozzle spring of the placement head is stuck.