Mobile Phone PCB Board

Product Details


XIN DA Electric, one of the best manufacturers and suppliers in China, now brings you high-tech fr4 enig fax machine 6 layers pcb board at competitive price from its professional factory. With the most advanced technology and high-end equipment introduced from America and Japan, as well as qualified staff, we can assure you the high quality, high precision and long lifespan of our products.

Mobile phone specification:


Custom Circuit board

Solder mask

Green, black, yellow, white, blue

Min.Hole Size


Min.Line Spacing



Mobile phone

PCB lead time

3-5 days

PCB Service:   

1.PCB Layout,PCB design, PCB Production

2.Make high difficulty PCB(1-38 layers boards)

3.offer all Electric components


5.PCB delivery time:5-10 days

PCB board advantage:

1.Cost advantage
Have PCB board, circuit board, SMT patch factory cost
More than ten years of component management team
2. Fast delivery
PCB, SMT expedited service
24 hours + 24 hours, PCBA processing completed
3. Quality assurance
ISO9001:2015 Quality Management
UL certificate
4. International experience
10 years of PCBA manufacturing experience,
Serving more than 100 countries and domestic listed companies

PCB production process:

1. Printed circuit board: Print the drawn circuit board with transfer paper. Note that the sliding side faces itself. Generally, two boards are printed, that is, two boards are printed on one sheet of paper. Choose the production board that has the best print quality.
2. Cut the copper clad plate and use the photosensitive plate to make the whole circuit diagram.
3. Pretreatment of copper clad laminate: The oxide layer on the surface of the clad laminate is polished away with fine sandpaper to ensure that the toner on the thermal transfer paper can be firmly printed on the clad laminate when the circuit board is transferred. The board is bright and has no visible stains.
4. Transfer circuit board: Cut the printed circuit board into a suitable size, and attach the printed circuit board side to the copper clad board. After aligning, put the copper clad board into the heat transfer machine, and make sure that it is placed. The transfer paper is not misplaced.
5. Corrosion circuit board, reflow soldering machine: first check whether the circuit board is transferred completely. If there are a few places that have not been transferred, you can use black oil pen to repair.


1.What files should we offer?
A: If only need PCB, the Gerber files are needed; If need PCBA, both Gerber files and BOM are needed.

2.Can we visit your company?
A: Sure. Welcome to visit us in Shenzhen. And the other factory is in Guang Dong province.

3. How do you make sure the quality of the PCBs?
A: Our PCBs are all 100% test including Flying Probe Test, E-test or AOI. 

4.What is the M.O.Q?

A:  1pcs.

Contact below:
mobile phone:+86-18098922617
Skype: xingdapcbsales1

PCB Service:    

1.PCB Layout,PCB design, PCB Production

2.Make high difficulty PCB(1-38 layers boards)

3.offer all Electric components


5.PCB delivery time:5-10 days;




PCB Manufacture Capability




FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.


High Tg CCL is Available(Tg>=170)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)



Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Minimum Core


Copper Thickness

1/2 oz min; 12oz max

Min Trace Width & Line Spacing


Min Hole Diameter for CNC Drilling


Min Hole Diameter for Punching


Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Conductor Width(W)

+/-0.05mm(2mil) or +/-20% of original

Hole Diameter(H)


Non PTHL:+/-0.05mm(2mil)

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Warp & Twist


Insulation Resistance




Test Voltage


Panel Size

110 x 100mm(min)

660 x 600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min spacing between hole edge to circuitry pattern of an inner layer


Min spacing between board outline to circuitry pattern of an inner layer


Board thickness tolerance

4 layers:+/-0.13mm(5mil)





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