Fr4 BGA Currency Detector 10 Layers PCB

Parameter:

Profile tolerance:±0.10mm(4mil)
Board bend&warp: ≤0.7%
Insulation resistance: ＞1012Ωnormal
Through-hole resistance: ＜300Ωnormal
Electric strength: ＞1.3kv/mm
Current breakdown: 10A
Peel strength: 1.4N/mm
Soldmask regidity: ＞6H
Thermal stress: 288℃20Sec
Testing voltage: 50-300v
Min buried blind via: 0.2mm(8mil)
Outer cooper thickness: 1oz-5oz
Inner cooper thickness: 1/2 oz-4oz
Aspect ratio: 8:1
SMT min green oil width: 0.08mm
Min green oil open window: 0.05mm
Insulation layer thickness: 0.075mm-5mm
Aperture: 0.2mm-0.6mm
Special technology: Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish: HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Capable:
XD provide  one-stop service from PCB designing, manufacturing, assembling, components soucing,programming to testing.

Confidential and Nondisclosure Agreement:
We protect the Intellectual Property for our customers in the whole process. Our staff of trained professionals are all working under a strict confidentiality contract and keep[ the business secrets.

Multilayer Manufacture Process :