Drone UAV PCB Assembly Drone UAV PCB Mounting Drone UAV PCB Boards Drone UAV PCBs Drone UAV PCB

Drone UAV PCB Assembly Drone UAV PCB Mounting Drone UAV PCB Boards Drone UAV PCBs Drone UAV PCB
Product Details

Our strict quality control system for PCBA: 

1. E-test for PCB.
2. IQC for components.
3. AOI test
4. PCBA function test
5. FQC

We can provide PCBA for prototypes, small volume and mass production.

One-stop service for PCBA

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PCB Manufacture Capability

Item

Specification

Material

FR-4, FR1,FR2; CEM-1, CEM-3,Rogers, Teflon,Arlon,Aluminum Base, Copper Base,Ceramic, Crockery, etc.

Remarks

High Tg CCL is Available(Tg>=170℃)

Finish Board Thickness

0.2 mm-6.00mm(8mil-126mil)

Surface Finish

Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um)

Shape

Routing、Punch、V-cut、Chamfer

Surface Treatment

Solder Mask(black, green, white, red, blue, thickness>=12um, Block, BGA)

Silkscreen(black, yellow, white)

Peel able-mask(red, blue, thickness>=300um)

Minimum Core

0.075mm(3mil)

Copper Thickness

1/2 oz min; 12oz max

Min Trace Width & Line Spacing

0.075mm/0.075mm(3mil/3mil)

Min Hole Diameter for CNC Drilling

0.1mm(4mil)

Min Hole Diameter for Punching

0.6mm(35mil)

Biggest panel size

610mm * 508mm

Hole Position

+/-0.075mm(3mil) CNC Drilling

Conductor Width(W)

+/-0.05mm(2mil) or +/-20% of original

Hole Diameter(H)

PTHL:+/-0.075mm(3mil)

Non PTHL:+/-0.05mm(2mil)

Outline Tolerance

+/-0.1mm(4mil) CNC Routing

Warp & Twist

0.70%

Insulation Resistance

10Kohm-20Mohm

Conductivity

<50ohm

Test Voltage

10-300V

Panel Size

110 x 100mm(min)

660 x 600mm(max)

Layer-layer misregistration

4 layers:0.15mm(6mil)max

6 layers:0.25mm(10mil)max

Min spacing between hole edge to circuitry pattern of an inner layer

0.25mm(10mil)

Min spacing between board outline to circuitry pattern of an inner layer

0.25mm(10mil)

Board thickness tolerance

4 layers:+/-0.13mm(5mil)

 

SMT Capacity

SMT Item

Capacity

PCB Max. size

510mm*1200mm(SMT)

Chip component

1206 0805 0603 0402 0201 package

Min.pin space of IC

0.1mm

Min. space of BGA

0.1mm

Max.precision of IC assembly

 ±0.01MM

Assembly capacity

≥8 million piots/day

DIP capacity

4 DIP production lines

Assembly testing

Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT
  (Functional Circuit Test)

FCT(Functional Circuit Test)

Current test, voltage test, high temperature and low
temperature test, Drop Impact Test,aging test,
water proof test,leakage-proof test and etc.
Different test can be done according to your requirement.

Packaging&Shipping

DA Electric, one of the best manufacturers and suppliers in China, now brings you high-tech drone uav pcb assembly drone uav pcb mounting drone uav pcb boards drone uav pcbs drone uav pcb at competitive price from its professional factory. With the most advanced technology and high-end equipment introduced from America and Japan, as well as qualified staff, we can assure you the high quality, high precision and long lifespan of our products.

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