OEM/ODM Robot PCBA Robot PCB Assembly Robot Enclosure Assembly

OEM/ODM Robot PCBA Robot PCB Assembly Robot Enclosure Assembly
Product Details

SMT Item                                                        Capacity

PCB Max. size:                                                 510mm*460mm(SMT)                          
Chip component:                                              0805 0603  0402  0201 package

Min.pin space of IC:                                           0.1mm
Min. space of BGA:                                            0.1mm

Max.precision of IC assembly:                              ±0.03mm

Assembly capacity:                                            ≥8 million piots/day

DIP capacity:                                                    6 DIP production lines

Assembly testing:                                              Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test)

FCT(Functional Circuit Test):                               Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement.

Technical:

  • Professional surface mounting and through hole soldering technology;
  • Various sizes,like 1206,0805,0603,0402,0201 components SMT  technology;
  • X-ray ICT(In Circuit Test),FCT(Functional Circuit Test)  technology
  • Nitrogen gas reflow soldering  technology for SMT
  • High standard SMT&Solder Assembly line;
PCBA pictures:

Factory pictures:


 






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